Solderability of Injection Moldable Thermoset Resins for Use in 3D Mechatronic Integrated Devices

Hausler, Felix; Petillon, Simon; Dornheim, Johannes; Weser, Sascha; Eberhardt, W.; Zimmermann, André; Franke, Jörg

doi:10.1109/isse49702.2020.9121136

2020 43rd International Spring Seminar on Electronics Technology (ISSE) 2020

DOI: 10.1109/isse49702.2020.9121136

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Solderability of Injection Moldable Thermoset Resins for Use in 3D Mechatronic Integrated Devices

Felix Hausler

Simon Petillon

Johannes Dornheim

et al.

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2022

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Cited by 2 publications

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Solderability of Injection Moldable Thermoset Resins for Use in 3D Mechatronic Integrated Devices

Cited by 2 publications

References 10 publications

Pretreatment and Structuring of Spatial Circuit Carriers Based on Alumina for High Temperatures and High Frequencies

Pretreatment and Structuring of Spatial Circuit Carriers Based on Alumina for High Temperatures and High Frequencies

Manufacturing of Ceramic Based Mechatronic Integrated Devices Using Laser-Direct-Structuring

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