Thermal contact conductance across Si3N4—Si3N4 contact

Aikawa, Toshihiko; Winer, W. O.

doi:10.1016/0043-1648(94)90114-7

Cited by 15 publications

(6 citation statements)

References 14 publications

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“…For example, for a solid–solid interface created by vapor deposition or epitaxy, the contact is almost ideal and the conductance can be as high as 10∼1,000 MW m −2 K −1 (27). However, for macroscopic rough surfaces, the micron-scale asperity may significantly reduce the “effective contact” that is truly in touch, thus the measured conductance could be very low (for example, <0.01 MW m −2 K −1 ; refs 28,29). The exact values in the latter case also depend sensitively on the applied pressure as well as the transmitting medium caged in-between the rough surfaces.…”

Section: Discussionmentioning

confidence: 99%

Electron-beam-assisted superplastic shaping of nanoscale amorphous silica

Zheng

Wang

Cheng³

et al. 2010

Nat Commun

296

260

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Section: Discussionmentioning

confidence: 99%

Electron-beam-assisted superplastic shaping of nanoscale amorphous silica

Zheng

Wang

Cheng³

et al. 2010

Nat Commun

296

260

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“…For the mechanically joined interfaces we thus obtain G mech = 15 MW m –2 K –1 . Typical approaches for joining interfaces macroscopically result in very poor contacts and therefore the interface conductance values are typically , on the order of 0.1 MW m –2 K –1 . Our results are closer to the interface conductance values of evaporated interfaces, which typically range between 20 and 500 MW m –2 K –1 and are consistent with prior measurements for thin nanomembranes mechanically transferred to a host substrate …”

mentioning

confidence: 99%

Thermal Conductivity of Mechanically Joined Semiconducting/Metal Nanomembrane Superlattices

et al. 2014

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The decrease of thermal conductivity is crucial for the development of efficient thermal energy converters. Systems composed of a periodic set of very thin layers show among the smallest thermal conductivities reported to-date. Here, we fabricate in an unconventional but straightforward way hybrid superlattices consisting of a large number of nanomembranes mechanically stacked on top of each other. The superlattices can consist of an arbitrary composition of n- or p-type doped single-crystalline semiconductors and a polycrystalline metal layer. These hybrid multilayered systems are fabricated by taking advantage of the self-rolling technique. First, differentially strained nanomembranes are rolled into three-dimensional microtubes with multiple windings. By applying vertical pressure, the tubes are then compressed and converted into a planar hybrid superlattice. The thermal measurements show a substantial reduction of the cross-sectional heat transport through the nanomembrane superlattice compared to a single nanomembrane layer. Time-domain thermoreflectance measurements yield thermal conductivity values below 2 W m(-1) K(-1). Compared to bulk values, this represents a reduction of 2 orders of magnitude by the incorporation of the mechanically joined interfaces. The scanning thermal atomic force microscopy measurements support the observation of reduced thermal transport on top of the superlattices. In addition, small defects with a spatial resolution of ∼100 nm can be resolved in the thermal maps. The low thermal conductivity reveals the potential of this approach to fabricate miniaturized on-chip solutions for energy harvesters in, e.g., microautonomous systems.

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“…The thermal conductance of mechanically‐joined materials has also been extensively studied because of their great practical importance in a wide variety of engineering systems 9, 10. The “thermal contact conductance” of joints is many orders of magnitude of smaller than the thermal conductance of interfaces formed by physical vapor deposition.…”

mentioning

confidence: 99%

Interfacial Thermal Conductance of Transfer‐Printed Metal Films

Kim

et al. 2011

Advanced Materials

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The thermal conductance of transfer‐printed interfaces is found to be surprisingly high, only a factor of 2–10 smaller than the thermal conductance of interfaces formed by physical vapor deposition. These results have practical importance for the thermal management of electronic devices assembled by transfer‐printing and provide fundamental insights on the nature of solid‐solid contacts between elastically stiff materials.

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Thermal contact conductance across Si3N4—Si3N4 contact

Cited by 15 publications

References 14 publications

Electron-beam-assisted superplastic shaping of nanoscale amorphous silica

Electron-beam-assisted superplastic shaping of nanoscale amorphous silica

Thermal Conductivity of Mechanically Joined Semiconducting/Metal Nanomembrane Superlattices

Interfacial Thermal Conductance of Transfer‐Printed Metal Films

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