Thermal Conductivity Variation with Temperature for Lead-Free Ternary Eutectic Solders

Aksöz, Namık; Öztürk, Esra; Bayram, Ümit; Aksöz, Sezen; Kervan, Selçuk; Ülgen, Ahmet; Maraşlı, Necmetti̇n

doi:10.1007/s11664-013-2748-z

Cited by 11 publications

(3 citation statements)

References 22 publications

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“…The melting point of the Sn–Pb solders is 183 °C, while that of Pb-free solders is 200 °C. Thus, the temperature in the reflow process must be raised to over 240 °C, which includes a margin of approximately 40 °C 9–11 . Meanwhile, the electronic components have a low thermal strength and would not be suitable for the reflow process.…”

Section: Introductionmentioning

confidence: 99%

A 64-pin Nanowire Surface Fastener Like a Ball Grid Array Applied for Room-temperature Electrical Bonding

Toku

Ichioka

Morita

et al. 2019

Sci Rep

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Surface-mount techniques primarily depend on soldering. However, soldering techniques have encountered some challenges in recent years. These challenges include rare metal recycling, thermal problems, and Pb toxicity. We recently developed a metallic nanowire surface fastener (NSF) to resolve the abovementioned problems. This fastener can be used to connect electronic components on a substrate at room temperature using the van der Waals force between each nanowire. This study demonstrates a 64-pin NSF that behaves like a ball grid array (BGA) for application to actual electronic devices. The adhesion strength and electrical properties of the NSF were investigated by adjusting the nanowire parameters, such as diameter, length, density (number per area), preload, and shape. The shape control of the nanowires greatly contributed to the improvement of the properties. A maximum adhesion strength of 16.4 N/cm2 was achieved using a bent, hook-like NSF. This strength was 4–5 times the value of the straight NSF. The contact resistivity was 2.98 × 10−2 Ω∙cm2. The NSF fabricated through the simple template method showed the room temperature bonding ability and adaptability to a highly ordered electrode like the BGA.

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Section: Introductionmentioning

confidence: 99%

A 64-pin Nanowire Surface Fastener Like a Ball Grid Array Applied for Room-temperature Electrical Bonding

Toku

Ichioka

Morita

et al. 2019

Sci Rep

View full text Add to dashboard Cite

show abstract

“…However, soldering completely locks electronic components and exhibits poor compatibility with bendable or stretchable device applications. Additionally, the Pb-free solder, which was developed to prevent Pb pollution and toxicity [1][2][3][4][5][6], has been extensively researched since the Waste Electrical and Electronic Equipment and Restriction of Hazardous Substances directives. The melting point of the Pb-free solder is 20 °C-30 °C higher than that of a conventional solder.…”

Section: Introductionmentioning

confidence: 99%

“…The melting point of the Pb-free solder is 20 °C-30 °C higher than that of a conventional solder. Thus, temperature of reflow process is at least 240 °C-250 °C, and it results in undesired thermal excursions and residual stress at a bonding interface [1,2,6]. The reflow process is undesirable as electric components have low thermal strength.…”

Section: Introductionmentioning

confidence: 99%

Nanowire surface fastener fabrication on flexible substrate

Toku

Uchida²,

Morita³

et al. 2018

Nanotechnology

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The market for wearable devices has increased considerably in recent years. In response to this demand, flexible electronic circuit technology has become more important. The conventional bonding technology in electronic assembly depends on high-temperature processes such as reflow soldering, which result in undesired thermal damages and residual stress at a bonding interface. In addition, it exhibits poor compatibility with bendable or stretchable device applications. Therefore, there is an urgent requirement to attach electronic parts on printed circuit boards with good mechanical and electrical properties at room temperature. Nanowire surface fasteners (NSFs) are candidates for resolving these problems. This paper describes the fabrication of an NSF on a flexible substrate, which can be used for room temperature conductive bonding. The template method is used for preparing high-density nanowire arrays. A Cu thin film is layered on the template as the flexible substrate. After etching the template, a Cu NSF is obtained on the Cu film substrate. In addition, the electrical and mechanical properties of the Cu NSF are studied under various fabrication conditions. The Cu NSF exhibits high shear adhesion strength (∼234 N cm) and low contact resistivity (2.2 × 10 Ω cm).

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Effect of Sn contents on thermodynamic, microstructure and mechanical properties in the Zn90–Bi10 and Bi88–Zn12 based ternary alloys

Esener

Altıntas

Bayram

et al. 2019

J Mater Sci: Mater Electron

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Thermal Conductivity Variation with Temperature for Lead-Free Ternary Eutectic Solders

Cited by 11 publications

References 22 publications

A 64-pin Nanowire Surface Fastener Like a Ball Grid Array Applied for Room-temperature Electrical Bonding

A 64-pin Nanowire Surface Fastener Like a Ball Grid Array Applied for Room-temperature Electrical Bonding

Nanowire surface fastener fabrication on flexible substrate

Effect of Sn contents on thermodynamic, microstructure and mechanical properties in the Zn90–Bi10 and Bi88–Zn12 based ternary alloys

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