Thermal conductivity epoxy resin composites filled with boron nitride

Gu, Junwei; Zhang, Qiuyu; Dang, Jing; Xie, Changsheng

doi:10.1002/pat.2063

Cited by 251 publications

(186 citation statements)

References 30 publications

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“…BN not only presents higher λ value, low moisture absorption, and high-temperature oxidation resistance but also its ε value is the lowest among ceramic fillers [174]. Gu et al [118] introduced the polyhedral oligomeric silsesquioxanefunctionalized nBN (POSS-g-nBN) fillers to increase the thermal conductivities of the bismaleimide (BMI) matrix.…”

Section: Bn Bnns and Bnntsmentioning

confidence: 99%

A review on thermally conductive polymeric composites: classification, measurement, model and equations, mechanism and fabrication methods

Yang

Liang

et al. 2018

Adv Compos Hybrid Mater

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294

124

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With the fast-developing miniaturization and integration of microelectronics packaging materials, ultrahigh-voltage electrical devices, light-emitting diodes (LEDs), and in areas which require good heat dissipation and low thermal expansion, the investigations on the polymeric composites with highly thermal conductivities and excellent thermal stabilities are urgently required, which would be beneficial to transferring the heat to the outside of the products, finally to effectively avoid substantial overheating and prolong their working life. Our article reviews recent progress in the classification, measurement methods, model and equations, mechanisms, commonly used thermally conductive fillers, and the correlative fabrication methods for the thermally conductive polymeric composites, aiming to understand and grasp how to enhance the λ value effectively. And future perspectives, focusing scientific problems and technical difficulties of the present thermally conductive polymeric composites are also described and evaluated.

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Section: Bn Bnns and Bnntsmentioning

confidence: 99%

A review on thermally conductive polymeric composites: classification, measurement, model and equations, mechanism and fabrication methods

Yang

Liang

et al. 2018

Adv Compos Hybrid Mater

Self Cite

294

124

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“…There are studies of epoxy compositions with increased heat resistance using boron nitride as filler with preliminary treatment of its surface with siloxane modifiers [6][7][8][9].…”

Section: Research Of Existing Solutions Of the Problemmentioning

confidence: 99%

Analysis of technological damageability of castings manufactured in sand molds

Кузін

Kusyj

Kuzin

2017

TAPR

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“…[1][2][3] Bismaleimide (BMI) resins, in particular, exhibit characteristics such as excellent thermal oxidation stabilities, dielectric properties, humidity and corrosion resistance. [4] Therefore, BMI-based resins have become one of the most versatile highperformance thermosetting materials with a wide range of applications in both microelectronics and aerospace.…”

Section: Introductionmentioning

confidence: 99%

Synthesis and characterization of multifunctional propenyl-endcapped aromatic co-monomers and their use as bismaleimide modifiers

Wang

Liu

et al. 2015

Polym. Adv. Technol.

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A series of novel modifiers for bismaleimide, bearing propenyl and phenoxy functional groups has been synthesized. Structural information of the monomers was obtained through Fourier transform infrared spectroscopy (FT-IR), nuclear magnetic resonance (NMR) spectroscopy and elemental analysis. Polymerization characteristics demonstrate that all four systems prepared have a cure temperature below 210°C. This remarkably lower cure temperature compared to that of other polymerization reactions involving diallyl bisphenol A and bismaleimide (DBMI) originates from propenyl groups being present in the structures as well as their larger free volume. The rheological behaviors leading to low melt viscosities and the wide process window of the prepolymer are particularly suitable characteristics for the production of performance resin-based composite materials via resin transfer molding processes. The dynamic mechanical analysis of the materials reveals glass transition temperatures in a range between 260°C and 293°C. Thermal stabilities show a 5% weight loss at temperatures ranging from 363°C to 428°C with the production of char ranging from 38.5% to 57.6% at 800°C under nitrogen. The latter is a clear indication for the excellent thermal stabilities featured by the cured resins. Furthermore, the dielectric properties exhibit a significantly lower dielectric constant and dissipation factors of the propenyl-modified cured systems compared to those of DBMI resins at 10 GHz.

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Thermal conductivity epoxy resin composites filled with boron nitride

Cited by 251 publications

References 30 publications

A review on thermally conductive polymeric composites: classification, measurement, model and equations, mechanism and fabrication methods

A review on thermally conductive polymeric composites: classification, measurement, model and equations, mechanism and fabrication methods

Analysis of technological damageability of castings manufactured in sand molds

Synthesis and characterization of multifunctional propenyl-endcapped aromatic co-monomers and their use as bismaleimide modifiers

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