Thermal conductivity controlled by a segregated network prepared using carbon nanotube/polyamide 6 composite with glass bubbles

Novel metastable intermixed composites (MICs) constructed by carbon nanomaterials are expected to achieve high energy content and high combustion efficiency, but traditional preparation technologies always bring barely improvement in performance. Herein, novel PVDF/CuO/Al@CNTs MICs with independent continuous carbon nanotubes (CNTs) conductive networks were prepared by thoroughly utilizing the conductivity and photothermal properties of CNTs. A conductive network can be constructed at the interface of each encapsulated PVDF/CuO/Al particle with the addition of >0.5 wt% CNTs. The great increase in electrical and thermal conductivity of PVDF/CuO/Al@CNTs MICs indicates excellent energy transfer efficiency across the sample. Significant enhancement of the combustion reaction has been achieved, with the minimum ignition energy and ignition delay time of PVDF/CuO/Al@CNTs3 reduced by ~31% and ~50%, respectively. This indicates that the CNTs with unique photothermal properties can be utilized as an effective igniter. Moreover, the optimal PVDF/CuO/Al@CNTs1 MICs enhanced the pressurization rate (~300%), energy output (~55%), and combustion velocity (~200%). The mechanism of the fast combustion reaction can also be discussed by the weak interface interaction and the energy conductive of the CNTs network throughout the sample. This work provides a modern strategy for strong combustion MICs that can be generalized and applied in the field of energetic materials.Highlights An independent continuous CNTs conductive network was prepared with a small amount of CNTs. The electrical and heat conversion efficiency is greatly improved. CNTs with unique photothermal properties can be utilized as an effective igniter. The laser sensitivity is improved, and the reaction energy, pressure, and pressure rates are significantly increased. The combustion performance was significantly improved, and more intense, and the combustion speed was significantly increased.

Section: Introductionmentioning

confidence: 99%

Constructing independent CNTs conductive network to boost combustion performance of metastable intermixed composites

Yang,

Liu,

Meng

et al. 2024

“…Nowadays, matrix resins are usually reinforced by the use of thermal conductive filler 7,8 (e.g., metallic fillers, 9,10 carbon‐based materials, 11–15 and ceramic fillers 16–22 ) to enhance the TC values. Among these, ceramic fillers (Al 2 O 3 , SiO 2 , AlN, Si 3 N 4 , MgO, and BN) have been widely investigated for their potential in thermal conductive and electrical insulation in composites due to their inherent properties.…”

Section: Introductionmentioning

confidence: 99%

Substantial improvement of thermal conductivity and mechanical properties of polymer composites by incorporation of boron nitride nanosheets and modulation of thermal curing reaction

He,

Zhang,

Liu

et al. 2023

Thermal conductive polymer‐based composites synchronously with stable dielectric and excellent mechanical properties are urgently needed for high‐temperature‐resistant electronic devices. Here, a significant improvement in the thermal conductivity (TC), thermal stability, dielectric, and mechanical performance was simultaneously achieved in the polyarylene ether nitrile (PEN)/divinyl siloxane‐bisbenzocyclobutene (BCB) matrix through the incorporation of boron nitride nanosheets (BNNS) combined together with the post‐solid phase chemical reaction technique. The significant increase in the effective filler‐filler and filler‐crystal contacts in the composites was the main reason for the improvement in TC and dielectric constant. Besides, glass transition temperature (Tg) and mechanicals were enhanced in the presence of cross‐linked networks. By synchronously adding 15 vol% BNNS, the TC of composites after treatment reached up to 5.582 W/m.K, enhanced by 4.4 times higher than untreated. The dielectric constant was down to 2.93 at 1 MHz and the loss remained at a relatively low level. Meanwhile, the composite showed significantly enhanced thermal stability, mechanicals, and hydrophobicity (Tg = 336°C, T5% = 529°C, tensile strength and modulus was 94.5 MPa and 5.3 GPa, respectively, the contact angle was 101.76°). Thus, it promotes an effective strategy for fabricating a high‐performance‐polymer composite, which has the potential used in electronic materials.Highlights Crystallization‐crosslinking strategy optimizes overall performance. Crystals fill gaps between BNNS layers and connect thermal conductive pathway. Crosslinked networks limit molecular chain motion to reduce phonon scattering. The highest TC of the PEN/BCB/BNNS composite is up to 7.451 W/m.K. Thermal property shows significant improvement after crosslinking especially Tg.

“…[3][4][5][6] In order to enhance the thermal conductivity of polymers for electronic packaging applications, it is imperative to simultaneously ensure their exceptional electrical insulation properties. Metal particles, 7 graphene, 8,9 carbon nanotubes, [10][11][12] and so on have excellent thermal conductivity, but these fillers will reduce the insulating performance of the polymers. Consequently, fillers exhibiting high intrinsic thermal conductivity and exceptional insulation performance are deemed desirable.…”

Section: Introductionmentioning

confidence: 99%

Enhancing cryogenic thermal conductivity of epoxy composites through the incorporation of boron nitride nanosheets/nanodiamond aerogels prepared by directional‐freezing method

Zhou,

Wu,

Liu

et al. 2023

In the realm of electronic circuits, materials with high thermal conductivity are sought after as ideal packaging components. It is crucial that such materials not only possess excellent thermal conductivity, but also maintain desirable dielectric properties. To this end, boron nitride nanosheets (BNNS) and BNNS/nanodiamond (ND) aerogels with a three‐dimensional (3D) structure using the ice‐template method were prepared. Subsequently, these aerogels were utilized as a framework to produce 3D‐BNNS/epoxy and 3D‐BNNS/ND/epoxy composites via the vacuum‐assisted impregnation method, which exhibit enhanced anisotropic thermal conductivity. Furthermore, the thermal conductivity exhibited by the 3D‐BNNS/epoxy composites outperforms those containing randomly distributed BNNS. The experiment also reveals sintering the aerogel at elevated temperatures to remove the PVA can significantly improve the thermal conductivity exhibited by the 3D‐BNNS/epoxy and 3D‐BNNS/ND/epoxy composites. Importantly, the 3D‐BNNS/ND/epoxy composites illustrate exceptional thermal conductivity values of 1.326 W/(m·K), indicating a remarkable synergistic effect of BNNS and ND in improving thermal conductivity. It is noteworthy to state that the relative thermal conductivity ratio of the 3D‐BNNS/epoxy and 3D‐BNNS/ND/epoxy composites to pure epoxy resin was markedly higher at lower temperatures than the values measured at room temperature, signifying their superior heat transfer performance at lower temperatures. In addition, the composites depict excellent dielectric properties and lower coefficients of thermal expansion values. Finally, the 3D‐BNNS/ND/epoxy composites also have significantly improved Tg (132.5 and 152.6°C). The high‐performance polymer composites described in this study are envisaged for implementation within the realm of electronic packaging materials.