Enhancing cryogenic thermal conductivity of epoxy composites through the incorporation of boron nitride nanosheets/nanodiamond aerogels prepared by <scp>directional‐freezing</scp> method

Zhou, Zhengrong; Wu, Zhixiong; Liu, Huiming; Huang, Chuanjun; Wang, Tao; Zhao, Yalin; Miao, Zhicong; Xiang, Yue; Geng, Zhen; He, Feng; Xu, Dong; Huang, Rongjin; Li, Laifeng

doi:10.1002/pc.27947

Cited by 6 publications

(1 citation statement)

References 57 publications

(100 reference statements)

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“…This unique network imparts BNNSs/PU composite materials with exceptionally high thermal conductivity and efficient cooling performance. Additionally, researchers have developed directional freeze casting approaches, , and controlled temperature gradient methods to achieve control over freeze casting, thereby preparing the desired functional 3D BN-based macroscopic structures.…”

Section: Strategies For Synthesis Of 3d H-bn Nanomaterialsmentioning

confidence: 99%

Methods for Preparation of Hexagonal Boron Nitride Nanomaterials

Yang,

Dai,

Jiang

et al. 2024

Chem. Mater.

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Section: Strategies For Synthesis Of 3d H-bn Nanomaterialsmentioning

confidence: 99%

Methods for Preparation of Hexagonal Boron Nitride Nanomaterials

Yang,

Dai,

Jiang

et al. 2024

Chem. Mater.

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Regulating surface energy and establishing covalent bonds to enhance interface interaction between m‐BN and polyphenylene oxide for 5G applications

Liao,

Ruan,

Zhang

et al. 2024

Polymer Composites

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Incorporation of boron nitride (BN) into polymers is a promising method to obtain composites with high thermal conductivity, low dielectric constant (Dk), and dielectric loss (Df), while the practical applications are limited by the poor interface between BN and polymer because of surface energy mismatch and absence of covalent bond connection between them. Herein, polydopamine (PDA) with good adhesion is deposited onto the BN. Then, a different amount of silane coupling agent containing vinyl reactive groups is grafted onto PDA‐coated BN. In this way, the surface energy of modified BN (m‐BN) can be adjusted to ensure BN contacts well with polymers. Moreover, reactive groups were introduced on BN for further reaction. Subsequently, covalent bonds between the m‐BN and the polyphenylene oxide (PPO) were established in situ during the curing process. The effects of the m‐BN surface energy on interface quality and thermal conductivity of composites are investigated. The m‐BN/PPO composite achieves a through‐plane thermal conductivity of 5.87 W/m·K and a low Df value of 1.53 × 10−3, as well as a low coefficient of thermal expansion (CTE) value (7.8 ppm/K) when the m‐BN loading is 32.6 vol%. This research provides a simple and efficient strategy for fabricating high‐performance composites for high‐frequency applications.Highlights Hexagonal boron nitride was modified successfully by combining non‐covalent and covalent modifications. Regulating surface energy and establishing covalent bonds enhances interface interaction between BN and polyphenylene oxide. Modified BN/polyphenylene oxide composites display improvements in thermal conductivity and dimensional stability as well as dielectric loss. Provides a feasible strategy for designing polymer composites with high thermal conductivity, dimensional stability, and low dielectric loss for 5G applications.

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The preparation and feasibility analysis of magnetic orientation method in the study of thermal insulation composite materials in the field of electronic packaging

You,

Weng,

et al. 2024

Polymer Composites

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As an emerging field of current technological development, the heat dissipation performance of electronic packaging materials has become the key to determining product reliability. Therefore, the applied thermal interface materials (TIMs) need to simultaneously meet the performance indicators of thermal conductivity, mechanics, and insulation. Although BN had excellent in‐plane thermal conductivity and insulation performance, it is currently difficult to achieve vertical orientation of powder which leads the layered powder cannot complete a continuous and effective heat transfer path along the Z‐axis direction inside the composite material. In order to solve the above two problems, out‐of‐plane thermal conductive composite was prepared by introducing magnetic oriented method. In order to comprehensively evaluate the thermal conductivity, mechanical and electrical properties, BN@Fe3O4/EP magnetic oriented composites were compared with BN@PDA‐Al2O3/EP composite prepared by mechanical blending method. The vertical thermal conductivity of the magnetic oriented composite material was 2.24 W/(m·K) at 30 vol%, which was 3.39 times that of the blended composite material and 12.4 times that of pure EP. This proves that the magnetic oriented composite materials prepared by the research institute can meet the vertical heat transfer needs in the field of electronic packaging and have high research value in this area.Highlights BN@Fe3O4 core–shell particles were prepared with both thermal conductivity and magnetic controllability. The thermosetting composites were prepared by heated through preliminary gel point and then cured at high temperature. The orientation of powder inside the matrix was constructed, resulted in excellent out‐of‐plane heat transfer performance. Comparisons were made between various properties of magnetic oriented materials and conventional blend materials. The magnetic orientation method is feasible in the field of electronic packaging.

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Enhancing cryogenic thermal conductivity of epoxy composites through the incorporation of boron nitride nanosheets/nanodiamond aerogels prepared by directional‐freezing method

Cited by 6 publications

References 57 publications

Methods for Preparation of Hexagonal Boron Nitride Nanomaterials

Methods for Preparation of Hexagonal Boron Nitride Nanomaterials

Regulating surface energy and establishing covalent bonds to enhance interface interaction between m‐BN and polyphenylene oxide for 5G applications

The preparation and feasibility analysis of magnetic orientation method in the study of thermal insulation composite materials in the field of electronic packaging

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