Thermal conductivity and mechanical properties of aluminum nitride filled linear low‐density polyethylene composites

Abstract

To acquire polymer composites with high thermal conductivity and mechanical properties, the aluminum nitride (AlN) microparticles modified with titanate coupling reagent of isopropyltrioleictitanate (NDZ-105) were employed to blend linear low-density polyethylene (LLDPE) via powder mixing method. Thermal conductive coefficient of the AlN/LLDPE composites was measured using hot disk thermal analyzer, and the thermal stability characteristics of AlN/LLDPE composites were mainly investigated via thermogravimetric analyzer (TGA) and differential scanning calorimeter (DSC). The results indicated that the use of AlN particles modified by NDZ-105 significantly enhanced thermal conductivity and mechanical properties of AlN/LLDPE composites. The thermal conductivity coefficient k was 1.0842 W/mk with 30% volume fraction of AlN, about three times higher than that of native LLDPE. The tensile strength of composites was maximum (17.42 MPa) with 20% mass fraction of AlN. DSC analyses results indicated that AlN had an influence on the melting temperature and the crystallinity of LLDPE. Additionally, TGA analyses showed that the thermal stability of LLDPE was significantly increased with addition of AlN.

Recent research developments in polymer heat exchangers – A review

“…Thermal and mechanical properties of aluminium nitride (AIN) filled low density polyethylene (LLDPE) composites were reported by Gu et al 17 . The relationship between the thermal conductivity of the composite and the AIN volume content was investigated experimentally.…”

Thermal Conductivity of Nanoparticles Filled Polymers

“…Being aware of the high electrical conductivity of metallic particles, several ceramic materials such as aluminum nitride (AlN), boron nitride (BN), silicon carbide (SiC) and beryllium oxide (BeO) gained more attention as thermally conductive fillers due to their high thermal conductivity and electrical resistivity (Nu et al, 2008) and (Ishida & Rimdusit, 1998). Thermal conductivities of composites with ceramic filler are influenced by filler packing density (Ohashi et al, 2005), particle size and size distribution (Yu et al, 2002) and , surface treatment (Gu et al, 2009) and mixing methods . Models and theories for predicting the thermal conductivity of polymer composites were discussed.…”

Thermally conductive polymer compounds for injection moulding: The synergetic effect of hexagonal boron-nitride and talc

“…To obtain composite materials with appropriate thermal conduction, high filler content is required, although it is resulting in difficult processability. Although the worsen flow properties, the increased thermal conductivity has a significant effect on the cooling of the part thus the cycle time can be decreased while it might have a negative effect on the shrinkage and warpage properties [1][2][3][4][5][6][7].…”

“…In electronics the tendency is producing smaller devices, therefore the amount of heat they generate is more and more. It leads the researchers to develop new polymer composite materials which can dissipate the heat form the parts [1][2][3][4].…”