1999
DOI: 10.1016/s0026-2714(99)00163-8
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Thermal characterization of power devices by scanning thermal microscopy techniques

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Cited by 15 publications
(9 citation statements)
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“…Single to be commercialized for more than 15 years, the Wollaston probe in passive mode was used for microsystem diagnostics . It was successfully used to characterize the temperature profile measurements of a PN thermoelectric couple and shown to be useful for failure localization and analysis of integrated circuits . These studies were made in ac regime.…”
Section: Applicationsmentioning
confidence: 99%
“…Single to be commercialized for more than 15 years, the Wollaston probe in passive mode was used for microsystem diagnostics . It was successfully used to characterize the temperature profile measurements of a PN thermoelectric couple and shown to be useful for failure localization and analysis of integrated circuits . These studies were made in ac regime.…”
Section: Applicationsmentioning
confidence: 99%
“…Brekel et al [11] propose soldering the gate-resistor directly onto an IGBT chip and using the temperature dependence of its resistance to evaluate the semiconductor temperature. Finally, more accurate methods use microprobes [27]. Their small size, which leads to a low thermal capacitance, allows fast measurements without any heat transfer disturbances.…”
Section: Introductionmentioning
confidence: 99%
“…Scanning probe techniques play an important role in understanding nanoscale energy conversion and transport. [1][2][3][4] Specifically, scanning thermal microscopy (SThM) has been widely used for local measurements of temperature fields, [5][6][7][8][9][10][11][12][13][14][15][16] thermal conductivity, [17][18][19] thermopower, 20,21 atomic-scale heat dissipation, 3 and even nanoscale thermal lithography. 22,23 In all SThM techniques, a temperature sensor (thermocouple or resistance-based thermometer), which can measure local temperatures and/or generate local heating, is integrated into the probe.…”
mentioning
confidence: 99%