Thermal characterization of electronic devices with boundary condition independent compact models

Lasance, C.J.M.; Vinke, H.; Rosten, H.I.

doi:10.1109/95.477457

Cited by 72 publications

(42 citation statements)

References 9 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…While the original name and formulation must be attributed to Bar-Cohen et al [18], the BC-approach seems to have evolved from the works of Andrews et al [29], Andrews [30], and Mahalingam [31]. Since its inception, it has been used by Gautier [32], Le Jannou and Huon [33], Lemczyk et al [34,35], Lasance et al [36], and several others.…”

Section: Nomenclaturementioning

confidence: 95%

See 1 more Smart Citation

Effective thermal conductivity of common geometric shapes

Brucker

Majdalani

2005

International Journal of Heat and Mass Transfer

View full text Add to dashboard Cite

Section: Nomenclaturementioning

confidence: 95%

“…This parameter is an important figure-of-merit used in characterizing the efficacy of competing chip layouts [36]. For a constant heat dissipation rate _ Q, it is calculated from…”

Section: The Equivalent Thermal Resistancementioning

confidence: 99%

Effective thermal conductivity of common geometric shapes

Brucker

Majdalani

2005

International Journal of Heat and Mass Transfer

View full text Add to dashboard Cite

“…[1][2][3][4][5] They are in the form of adispersion of electrically conductive particles, such as silver. It is desirable for the coating (i.e., thick film) resulting from the paint to be high in electrical conductivity and good in mechanical integrity (such as scratch resistance).…”

Section: Introductionmentioning

confidence: 99%

Improving the electrical and mechanical behavior of electrically conductive paint by partial replacement of silver by carbon black

Leong

Chung

2006

Journal of Elec Materi

View full text Add to dashboard Cite

Partial replacement of silver particles by carbon black (low cost) in electrically conductive paint was found to decrease the electrical resistivity and increase the scratch resistance of the resulting thick film, which is for use in electrical interconnections. An effective carbon black content is 0.055 of the total filler volume. By using atotal solid volume fraction of 0.1969 and asilane-propanol (1:1 by weight) solution as the vehicle, ap aint that gives at hick film with resistivity 2×1 0 −3 ⍀ ·cm has been attained.

show abstract

“…Precious metals, such as silver, gold, platinum, and palladium, [1][2][3][4][5] and other base metals, such as nickel, chromium, aluminum, and copper, 1,6-8 have been used as the main conductive components in thick-film materials. Most previous investigations used glass frit as the binder for bonding between the thick film and the substrate and for bonding among metal particles.…”

Section: Introductionmentioning

confidence: 99%

Comparative study of electrically conductive thick films with and without glass

Liu

Chung

2004

Journal of Elec Materi

View full text Add to dashboard Cite

An air-fireable, glass-free, electrically conductive thick-film material (96.6% Ag, 1.38% Cu, 0.28% Al, 0.35% Ti, and 1.39% Sn by weight) and a conventional glass-containing, electrically conductive thick-film material (96.6% Ag and 3.4% glass frit by weight), both on alumina substrates, were studied by electrical, mechanical, thermal, and microscopic methods. The volume electrical resistivity of the glass-free thick film (2.5 ϫ 10 Ϫ6 Ω·cm, 30-µm thick) is lower than that of the glass-containing thick film (3.9 ϫ 10 Ϫ6 Ω·cm, 19-µm thick), with each film processed at its optimum firing temperature. The optimum firing temperature is 930°C and 850°C for glass-free and glass-containing thick films, respectively, as indicated by the criteria of low resistivity and high scratch resistance. The glass-free thick film has a higher scratch resistance than the glass-containing thick film, both fired at their respective optimum temperatures, suggesting that the former has higher bond strength to the alumina substrate. The formation process of the glass-free and glass-containing thick films is similar. The process involves solid-state diffusion of silver, which results in a silver network and grain boundaries. However, the sintering of silver particulates in the glass-containing thick film is enhanced by the viscous flow of glass.

show abstract

Thermal characterization of electronic devices with boundary condition independent compact models

Cited by 72 publications

References 9 publications

Effective thermal conductivity of common geometric shapes

Effective thermal conductivity of common geometric shapes

Improving the electrical and mechanical behavior of electrically conductive paint by partial replacement of silver by carbon black

Comparative study of electrically conductive thick films with and without glass

Contact Info

Product

Resources

About