Effective thermal conductivity of common geometric shapes

Brucker, Kyle A.; Majdalani, Joseph

doi:10.1016/j.ijheatmasstransfer.2005.05.007

Cited by 25 publications

(12 citation statements)

References 50 publications

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“…ETC studies of the dry and fluid-saturated porous materials are useful in a number of other applications such as petroleum and natural gas geology [1][2][3][4], utilization of hydrothermal energy [5][6][7][8] and underground thermal energy storage [9,10], applications to geothermal problems and hydro-geological studies [11,12], civil engineering applications [13][14][15][16][17][18][19][20], composite materials [21][22][23], food and computer technologies, etc. [24].…”

Section: Introductionmentioning

confidence: 99%

Effect of temperature and pressure on the thermal conductivity of sandstone

Abdulagatova

Abdulagatov

Emirov

2009

International Journal of Rock Mechanics and Mining Sciences

181

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Section: Introductionmentioning

confidence: 99%

Effect of temperature and pressure on the thermal conductivity of sandstone

Abdulagatova

Abdulagatov

Emirov

2009

International Journal of Rock Mechanics and Mining Sciences

181

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“…In practice, to estimate the surface temperatures of an electronic board, which is assimilated to a flat plate in unlimited space, empirical correlations [9][10][11][12][13][14] are considering a set of dimensionless numbers, such as known Grashoff (Gr) Prandtl (Pr) or Rayleigh (Ra).…”

Section: Equivalent Heat Transfer Coefficient Calculationmentioning

confidence: 99%

Analytical thermal modelling of multilayered active embedded chips into high density electronic board

Monier-Vinard

Laraqi²,

Dia

et al. 2013

THERM SCI

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The recent Printed Wiring Board embedding technology is an attractive packaging alternative that allows a very high degree of miniaturization by stacking multiple layers of embedded chips. This disruptive technology will further increase the thermal management challenges by concentrating heat dissipation at the heart of the organic substrate structure. In order to allow the electronic designer to early analyze the limits of the power dissipation, depending on the embedded chip location inside the board, as well as the thermal interactions with other buried chips or surface mounted electronic components, an analytical thermal modelling approach was established. The presented work describes the comparison of the analytical model results with the numerical models of various embedded chips configurations. The thermal behaviour predictions of the analytical model, found to be within ±10% of relative error, demonstrate its relevance for modelling high density electronic board. Besides the approach promotes a practical solution to study the potential gain to conduct a part of heat flow from the components towards a set of localized cooled board pads

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“…The specific heat temperature dependence has been taken from data reported by Smith (Ref 19) while the following expression has been used in the transformation temperature range c 0 = c M (1 À n) + c A n. The values of the parameters necessary to integrate the Eq 1 are reported in Table 1 while all Nu is defined considering the wire position and its dependence on Rayleigh and Prandtl numbers ( Ref 20,21) and generally its value is larger when the wire is positioned vertically. However, it must be considered that in the case of the vertical wire position L c = L, while for the horizontal case L c = d so, the h value must be independent of d when placed vertically and independent of L c when positioned horizontally.…”

Section: Numerical Approachmentioning

confidence: 99%

Analysis of Wire Position and Operating Conditions on Functioning of NiTi Wires for Shape Memory Actuators

Zanotti

Giuliani

Arnaboldi

et al. 2011

J. of Materi Eng and Perform

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In this work an experimental-numerical approach was used to analyze the thermo-mechanical behavior of thin NiTi wires, electrically heated, finalized to defining the influence of both wire position and the operating conditions of the actuator functioning. Tests were carried out on wires having diameters of 80 and 150 lm, loaded by constant stresses of 100 and 200 MPa and characterized by DSC and strain/temperature hysteresis measurements. Two wire positions (horizontal and vertical) were adopted in single cycle tests and designed to obtain different typologies of the heating and cooling transients. In general, the heating time was selected to reach a steady state condition while the cooling time always allowed decreasing the wire temperature to the ambient one. Data concerning strain, applied current and voltage were simultaneously acquired during the tests. Moreover, for the optimization and validation of a numerical model, for the 150 lm wire in diameter was used, its temperature was recorded by IR thermographic system. On the basis of the collected experimental data, a simple model was tested to reproduce the experimental results and data regarding the heat exchange coefficient and wire electrical resistivity dependence on temperature were obtained. The influence of the experimental wire positioning and wire diameter on the free convection coefficient is reported and the results indicate that the heating transient is associated with different convection coefficients depending on the heating modalities.

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Effective thermal conductivity of common geometric shapes

Cited by 25 publications

References 50 publications

Effect of temperature and pressure on the thermal conductivity of sandstone

Effect of temperature and pressure on the thermal conductivity of sandstone

Analytical thermal modelling of multilayered active embedded chips into high density electronic board

Analysis of Wire Position and Operating Conditions on Functioning of NiTi Wires for Shape Memory Actuators

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