The effect of silicon
nitride (Si
3
N
4
) as
a thermally conductive material on the mechanical, microstructural,
and physical properties as well as kinetics of the curing reaction
of styrene-butadiene rubber/butadiene rubber (SBR/BR) was investigated
in this work. The results showed an improvement in tensile, hardness,
and compression features of the composite due to the presence of Si
3
N
4
. The properties were enhanced with the filler
loading content; somehow, the composite including Si
3
N
4
= 6 parts per hundred (phr) had the most significant performance,
an increase of ∼15 and 20% in the maximum strain and toughness
of the composite, respectively, an increase of almost 7% in the hardness,
and an ∼13% reduction in the compression set. Also, the filler
led to an increase in the crosslink density (calculated via the Flory–Rehner
equation using swelling test) by 7.12 × 10
–5
mol/g, proving the increment of the covalent bonds between the polymer
chains during the curing reaction. The kinetic consideration revealed
a reduction in the scorch and optimum curing times by ∼40 and
∼25%, respectively. In order to describe the kinetics of curing
reaction of SBR/BR-Si
3
N
4
, an autocatalytic model
based on the Kamal–Sourour model was applied on the rheometry
results. The calculated kinetic parameters indicated that the thermally
conductive Si
3
N
4
accelerated the curing reaction
by ∼40%, particularly at Si
3
N
4
= 6 phr.
After 6 phr of Si
3
N
4
, agglomeration of the filler
particles decreased its performance.