A Comprehensive Study on the Effect of Highly Thermally Conductive Fillers on Improving the Properties of SBR/BR-Filled Nano-Silicon Nitride

Abstract

The effect of silicon nitride (Si 3 N 4 ) as a thermally conductive material on the mechanical, microstructural, and physical properties as well as kinetics of the curing reaction of styrene-butadiene rubber/butadiene rubber (SBR/BR) was investigated in this work. The results showed an improvement in tensile, hardness, and compression features of the composite due to the presence of Si 3 N 4 . The properties were enhanced with the filler loading content; somehow, the composite including Si 3 N 4 = 6 parts per hundred (phr) had the most significant performance, an increase of ∼15 and 20% in the maximum strain and toughness of the composite, respectively, an increase of almost 7% in the hardness, and an ∼13% reduction in the compression set. Also, the filler led to an increase in the crosslink density (calculated via the Flory–Rehner equation using swelling test) by 7.12 × 10 –5 mol/g, proving the increment of the covalent bonds between the polymer chains during the curing reaction. The kinetic consideration revealed a reduction in the scorch and optimum curing times by ∼40 and ∼25%, respectively. In order to describe the kinetics of curing reaction of SBR/BR-Si 3 N 4 , an autocatalytic model based on the Kamal–Sourour model was applied on the rheometry results. The calculated kinetic parameters indicated that the thermally conductive Si 3 N 4 accelerated the curing reaction by ∼40%, particularly at Si 3 N 4 = 6 phr. After 6 phr of Si 3 N 4 , agglomeration of the filler particles decreased its performance.

Recent progress in ladder-like polysilsesquioxane: synthesis and applications

“…Efficient heat dissipation is crucial for the convenient and safe operation of devices. 307,308 Dire's group made strides by introducing MPTMS-functionalized Al 2 O 3 into the LPSQ matrix. 117 This approach improved compatibility and allowed the particles to be well-dispersed without surfacing or aggregating.…”

Ladder-like Poly(methacryloxypropyl) silsesquioxane-Al2O3-polybutadiene Flexible Nanocomposites with High Thermal Conductivity

“…Even though several theoretical studies highlighted the effects of tuning intrinsic features of PB [30], it is imperative to introduce high thermally conductive fillers into the polymeric matrix to provide suitable materials for thermal management [19,31]. Considerable scientific efforts have been devoted to this field by using ceramic fillers such as silicon carbide (SiC) [32,33], silicon nitride (Si 3 N 4 ) [34], boron nitride (BN) [35,36], aluminum nitride (AlN) [37,38], zinc oxide (ZnO) [39][40][41], and alumina (Al 2 O 3 ) [42][43][44]. Out of these materials, alumina is widely used as a filler despite its lower thermal conductivity (ranging from 30 to 38 W m −1 K −1 ) compared to other ceramic fillers.…”