Thermal characterisation of embedded heat spreading layers in rectangular heat-generating electronic modules

Numerical Heat Transfer, Part A: Applications

Ighalo

2010

Section: Introductionmentioning

confidence: 99%

Combined Numerical Optimization and Constructal Theory for the Design of Microchannel Heat Sinks

Bello‐Ochende

Numerical Heat Transfer, Part A: Applications

Ighalo

2010

“…The augmentation of the volume-to-point or volume-to-surface type problem has been approached by a number of different methods, such as: utilizing constructal theory for various geometrically shaped volumes [1,4,7,8,13,27,31]; and embedding predefined conduit material geometries within a heat-generating volume [14][15][16]. The optimization of predefined non-complex conduit material geometries are effective in augmenting the power densities with the added benefit of tailoring the conduit material geometry for ease of manufacturability.…”

Section: Introductionmentioning

confidence: 99%

Topology optimization for the conduction cooling of a heat-generating volume with orthotropic material

Page

Dirker

International Journal of Heat and Mass Transfer

2016

Self Cite

“…This deterministic geometrical choice has a significant advantage from a manufacturing point of view. Previous work by the current authors also considered preselected geometrical types such as conductive embedded plate structures in power electronic modules in order to increase the effective power density [9][10][11].…”

Section: Introductionmentioning

confidence: 99%

Three-dimensional conductive heat transfer topology optimisation in a cubic domain for the volume-to-surface problem

Burger

Dirker

International Journal of Heat and Mass Transfer

2013

In this paper, three-dimensional topology optimisation was investigated with regard to heat conduction for the volume-to-point or volume-to-surface problem in a cubic three-dimensional domain. The positioning of high conductive material in a solid with low thermal conductivity and high heat generation was optimized via the method of moving asymptotes (MMA) algorithm in order to reduce the average internal temperature. Both partial and full Dirichlet temperature boundaries were considered. Thermal conductivity ratios ranging from 5 to 3 000 and volumetric constraint between 5% and 30% were covered. The high conductive material distributions were found to resemble those of natural tree-structures, with the four primary branches extending towards the furthest corners of the domain when a single seed-location was used. Multiple seed locations (two and four) were also considered. It was found that each seed location resulted in a separate conduction tree, each of which also had four primary branches. By increasing the number of seed locations from one to four, the thermal performance of the optimized internal architecture improved by up to 20% for a volumetric constraint of 5%.