2017
DOI: 10.1016/j.polymertesting.2016.12.013
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Thermal and volumetric property analysis of polymer networks and composites using elevated temperature digital image correlation

Abstract: Digital Image Correlation (DIC), which exploits non-contact advantages and full-field analysis, provides more data in-situ that are not possible with traditional techniques. In this work, elevated temperature digital image correlation techniques were applied to a glassy polymer network via thermal expansion and contraction experiments to study volumetric behavior during the curing process. A glassy epoxy network was tested in both cured and under-cured states and heated to the ultimate cure temperature. Matrix… Show more

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Cited by 6 publications
(6 citation statements)
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“…DIC systems use image analysis to observe the development of strain in a material. In the past, this technique had been used to study resin flow, crack development, and stress development in composite materials [9][10][11][12][13][14][15]. The use of a non-contact measurement technique in this study allowed the strain development of a prepreg sample through the complete process cycle to be captured.…”
Section: Digital Image Correlation (Dic)mentioning
confidence: 99%
“…DIC systems use image analysis to observe the development of strain in a material. In the past, this technique had been used to study resin flow, crack development, and stress development in composite materials [9][10][11][12][13][14][15]. The use of a non-contact measurement technique in this study allowed the strain development of a prepreg sample through the complete process cycle to be captured.…”
Section: Digital Image Correlation (Dic)mentioning
confidence: 99%
“…[21] Analysis of the thermal strain data is not limited to CLTE calculation, [13] but also includes quantification of strain field heterogeneity [21] and residual strain of composite laminates. [20] Recently, the bias error in DIC displacement measurements was reported to be less than 0.005 pixels, which for a gauge length of 400 pixels estimates a strain error of 12.5 microstrain. [22] When applied to (T-DIC) over a temperature delta of 50 C, the CLTE error is 0:25 Â 10 À6 = C: [12] To overcome the differential thermal expansion that exists between steel, aluminum, and carbon fiber reinforced composites, a mixed material composite structure comprised of a higher stiffness (E > 120 GPa), lower CLTE (α $ 0 ppm/ C) reinforcement (carbon fiber reinforced composite) embedded within a lower stiffness (E $ 72 GPa), higher CLTE (α $ 24 ppm/ C) "matrix" material (aluminum) is studied.…”
Section: Introductionmentioning
confidence: 99%
“…[18] Interferometry is highly suited for measuring small displacements (10 À3 m) with Fizeau interferometers commonly used for CLTE measurements of samples smaller than those typically used in quartz rod dilatometry (10 Â 10 À3 m). [10] Digital image correlation [19] is an effective method for full-field strain measurement, and has been utilized to measure the thermal strains in metals, [12] films, [13,14] composites, [12,20] and polymers. [21] Analysis of the thermal strain data is not limited to CLTE calculation, [13] but also includes quantification of strain field heterogeneity [21] and residual strain of composite laminates.…”
Section: Introductionmentioning
confidence: 99%
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“…Curing also causes shrinkage that can influence the surface quality of the component. Depending on the geometry of the part, thermal and curing shrinkage can also create internal stresses that can weaken the part or lead to cracking [6][7][8][9][10][11][12]. Further, the heat generated during the cure in an exothermic reaction needs to be controlled.…”
Section: Introductionmentioning
confidence: 99%