Thermal Analysis Technique for Printed Wiring Board Using Admittance Matrix

Kanazawa, Tomohisa; Hatanaka, Ayumu; Kusuno, Nobuhiro; Mishima, Akira

doi:10.1541/ieejias.132.94

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Cited by 3 publications

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“…The model was based on the temperature difference model 29) and the admittance matrix model. 30) Table I shows the parameters used in this analysis. MATLAB/Simulink (numerical calculation language software) were used to develop the model.…”

Section: Simulation Modelmentioning

confidence: 99%

Mechanism of thermal runaway in solar cells

Nakamura

Imaizumi

Murai

et al. 2023

Jpn. J. Appl. Phys.

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To clarify the mechanism of thermal runaway in solar cells, our study included experiments and simulations that focused on changes in the size of the shunt spot where thermal runaway occurs. Our analysis suggests that the rapid temperature increase of the shunt spot leading to failure is caused by the positive feedback of increased backflow current, increased heat generation, and reduced shunt spot size (i.e., increased combined thermal resistance between the shunt spot and normal cell area). The thermal runaway tolerance can be improved by designing solar cells with negative feedback that prevents positive feedback from progressing.

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Section: Simulation Modelmentioning

confidence: 99%