Thermal analysis of an innovative flat heat pipe radiator

Abstract

An innovative flat heat pipe radiator was put forward, and it has the features of high efficiency of heat dissipation, compact construction, low thermal resistance, light weight, low cost, and anti-dust-deposition. The thermal analysis of the flat heat pipe radiator for cooling high-power light emitting diode (LED) array was conducted. The thermal characteristics of the flat heat pipe radiator under the different heat loads and incline angles were investigated experimentally in natural convection. An electro-thermal conversion method was used to measure the junction temperature of the LED chips. It is found that the integral temperature distribution of the flat heat pipe radiator is reasonable and uniform. The total thermal resistance of the flat heat pipe radiator varies in the range of 0.38−0.45 K/W. The junction temperatures of LED chips with the flat heat pipe radiator and with the aluminum board at the same forward current of 0.35 A are 52.5 and 75.2 ºC, respectively.