Thermal Analysis, Characterization and and Material Selection for SiC Device Based Intelligent Power Module (IPM)

Tang, Gongyue; Wai, Leong Ching; Lim, Siak Boon; Lau, Boon Long; Yamamoto, Kazuya; Zhang, Xiaowu

doi:10.1109/ectc32862.2020.00322

Cited by 11 publications

(4 citation statements)

References 5 publications

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“…Results demonstrated that a heat dissipation capacity of 1623 W was obtained for a 20 • C device temperature rise above the ambient, indicating approximately 1.8 times improvement over the commonly used single-phase forced liquid cooling with a pin fin cold plate. Tang et al [97] proposed a SiC-based power module with integrated temperature sensors using the dual-side liquid cooling via jet impingement. The cooling performance of this liquid cooling system was improved by optimizing the flow channel width, nozzle length, and jet to wall distance.…”

Section: Jet Impingement Coolingmentioning

confidence: 99%

Thermal Management Technologies Used for High Heat Flux Automobiles and Aircraft: A Review

Zhang

Wang

et al. 2022

Energies

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In recent years, global automotive industries are going through a significant revolution from traditional internal combustion engine vehicles (ICEVs) to electric vehicles (EVs) for CO2 emission reduction. Very similarly, the aviation industry is developing towards more electric aircraft (MEA) in response to the reduction in global CO2 emission. To promote this technology revolution and performance advancement, plenty of electronic devices with high heat flux are implemented on board automobiles and aircraft. To cope with the thermal challenges of electronics, in addition to developing wide bandgap (WBG) semiconductors with satisfactory electric and thermal performance, providing proper thermal management solutions may be a much more cost-effective way at present. This paper provides an overview of the thermal management technologies for electronics used in automobiles and aircraft. Meanwhile, the active methods include forced air cooling, indirect contact cold plate cooling, direct contact baseplate cooling, jet impingement, spray cooling, and so on. The passive methods include the use of various heat pipes and PCMs. The features, thermal performance, and development tendency of these active and passive thermal management technologies are reviewed in detail. Moreover, the environmental influences introduced by vibrations, shock, acceleration, and so on, on the thermal performance and reliability of the TMS are specially emphasized and discussed in detail, which are usually neglected in normal operating conditions. Eventually, the possible future directions are discussed, aiming to serve as a reference guide for engineers and promote the advancement of the next-generation electronics TMS in automobile and aircraft applications.

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Section: Jet Impingement Coolingmentioning

confidence: 99%

Thermal Management Technologies Used for High Heat Flux Automobiles and Aircraft: A Review

Zhang

Wang

et al. 2022

Energies

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“…For instance, in 2020 Liu et al [100] presented double-sided cooling of the SiC power module, and Möller et al [92] suggested a double-sided cooling concept for an automotive application. Moreover, a double-sided liquid cooling module with jet impingement was reported in Tang et al [101].…”

Section: Double-sided Coolingmentioning

confidence: 99%

“…Energies 2021, 14, x FOR PEER REVIEW 10 of 2 application. Moreover, a double-sided liquid cooling module with jet impingement wa reported in Tang et al [101]. Catalano et al [28] carried out an investigation of SiC-based power modules arrange in a half-bridge to prove the efficiency of double-sided cooling (the concept of the double sided module is shown in Figure 10).…”

Section: Double-sided Coolingmentioning

confidence: 99%

A Thorough Review of Cooling Concepts and Thermal Management Techniques for Automotive WBG Inverters: Topology, Technology and Integration Level

et al. 2021

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The development of electric vehicles (EVs) is an important step towards clean and green cities. An electric powertrain provides power to the vehicle and consists of a charger, a battery, an inverter, and a motor as the main components. Supplied by a battery pack, the automotive inverter manages the power of the motor. EVs require a highly efficient inverter, which satisfies low cost, size, and weight requirements. One approach to meeting these requirements is to use the new wide-bandgap (WBG) semiconductors, which are being widely investigated in the industry as an alternative to silicon switches. WBG devices have superior intrinsic properties, such as high thermal flux, of up to 120 W/cm2 (on average); junction temperature of 175–200 °C; blocking voltage limit of about 6.5 kV; switching frequency about 20-fold higher than that of Si; and up to 73% lower switching losses with a lower conduction voltage drop. This study presents a review of WBG-based inverter cooling systems to investigate trends in cooling techniques and changes associated with the use of WBG devices. The aim is to consider suitable cooling techniques for WBG inverters at different power levels.

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“…The integration designs of a better heat dissipation scheme and smaller thermal resistance, as well as a smaller difference in thermal resistance, are becoming the core of the thermal design of highly integrated PCU modules [7][8][9][10]. There are extensive research works on the thermal design of PCU modules, such as the double-side heat dissipation design [11][12][13][14], the power card design for optimal liquid cooling [15] by Toyota, and the calculation method for optimal control parameters of liquid cooling of a highly integrated PCU module [16].…”

Section: Introductionmentioning

confidence: 99%

Investigation on Thermal Resistance and Capacitance Characteristics of a Highly Integrated Power Control Unit Module

et al. 2021

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With the increasing integration density of power control unit (PCU) modules, more functional power converter units are integrated into a single module for applications in electric vehicles or hybrid electric vehicles (EVs/HEVs). Different types of power dies with different footprints are usually placed closely together. Due to the constraints from the placement of power dies and liquid cooling schemes, heat-flow paths from the junction to coolant are possibly inconsistent for power dies, resulting in different thermal resistance and capacitance (RC) characteristics of power dies. This presents a critical challenge for optimal liquid cooling at a low cost. In this paper, a highly integrated PCU module is developed for application in EVs/HEVs. The underlying mechanism of the inconsistent RC characteristics of power dies for the developed PCU module is revealed by experiments and simulations. It is found that the matching placement design of power dies with a heat sink structure and liquid cooler, as well as a liquid cooling scheme, can alleviate the inconsistent RC characteristics of power dies in highly integrated PCU modules. The findings in this paper provide valuable guidance for the design of highly integrated PCU modules.

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Thermal Analysis, Characterization and and Material Selection for SiC Device Based Intelligent Power Module (IPM)

Cited by 11 publications

References 5 publications

Thermal Management Technologies Used for High Heat Flux Automobiles and Aircraft: A Review

Thermal Management Technologies Used for High Heat Flux Automobiles and Aircraft: A Review

A Thorough Review of Cooling Concepts and Thermal Management Techniques for Automotive WBG Inverters: Topology, Technology and Integration Level

Investigation on Thermal Resistance and Capacitance Characteristics of a Highly Integrated Power Control Unit Module

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