Thermal analysis and mechanical properties of Sn–1.0Ag–0.5Cu solder alloy after modification with SiC nano-sized particles

El-Daly, A.A.; Fawzy, A.; Mansour, S.F.; Younis, M.J.

doi:10.1007/s10854-013-1200-8

Cited by 54 publications

(25 citation statements)

References 17 publications

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“…These particles in the solder can hinder the lattice dislocation by blocking grain boundaries and form intermetallic compounds (IMCs) that have better characteristics, to make the grain finer and improve the resistant to thermal, mechanical and electrical stresses [6][7][8]. Metals, such as Ag, Au, Al, Ni, Cu, Cd, Zn, Mo and some rare-earth materials [9,10], and non-metallic materials, such as SiC, TiO 2 , Al 3 O 2 , carbon tube, graphen and even diamond [11][12][13][14][15], are studied as the doped particles to improve the mechanical properties of lead-free solder joints. According to these studies, there are two methods that are commonly used to add the reinforced particles into the solder.…”

Section: Introductionmentioning

confidence: 99%

A study of Ag additive methods by comparing mechanical properties between Sn57.6Bi0.4Ag and 0.4 wt% nano-Ag-doped Sn58Bi BGA solder joints

Sun

Chan

2014

J Mater Sci: Mater Electron

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Sn-Bi solder was proposed as one of the most promising substitutes for lead solder due to its lower melting temperature, good wettability, good yield strength and cost efficiency. With Ag elements added, the mechanical properties of Sn-Bi solder were improved obviously. There are two ways that are commonly used to add the reinforced particles into the solder. The first way (Way I) is to blend the reinforced particles with solder powders together, and then followed by pressure forming, sintering, cooling, crystallization and serious machining methods under inert atmosphere to make the solder paste. Another way (Way II) is to directly add the reinforced nano or micro particles into the solder paste by sufficient mechanical-stirring. In this research we would like to get fully understanding on the effects of these two ways of Ag addition on the mechanical properties of Sn-Bi-Ag solder joints during aging. Sn57.6Bi0.4Ag solder stands for the Way I and the doped Sn58Bi ? 0.4Ag solder stands for the Way II. These two kinds of joints were compared via micromorphology observation, thermal failure analyses as well as balls shear strength measurement after different aging time (under 100°C, from 0 to 800 h). The mechanical properties of Sn57.6Bi0.4Ag and the doped Sn58Bi ? 0.4Ag solder joints during aging were shown to be associated with the changes of micromorphology, the dissolution of IMCs, as well as the flatness of the joints' interface. Before long-time aging, the doped Sn58Bi ? 0.4Ag solder joints showed better mechanical performance than Sn57.6Bi0.4Ag solder joints. During aging, Sn56.7Bi0.4Ag solder joints had better performance in preventing the dissolution of Ni-Sn IMCs into the solder side, having smoother interfaces, comparing with Sn58Bi ? 0.4Ag solder joints. The degenerated phenomenon of Ag nanoparticle reinforcement seriously happened in the doped Sn58Bi ? 0.4Ag solder joints. After longtime aging, Sn57.6Bi0.4Ag solder joints had better mechanical properties than the doped Sn58Bi ? 0.4Ag solder joints.

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Section: Introductionmentioning

confidence: 99%

A study of Ag additive methods by comparing mechanical properties between Sn57.6Bi0.4Ag and 0.4 wt% nano-Ag-doped Sn58Bi BGA solder joints

Sun

Chan

2014

J Mater Sci: Mater Electron

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“…The microstructure and morphology of the solder joints have a significant influence on its mechanical properties [16]. With the aging process, the solder's interface compound layer thickens, the internal matrix structure coarsens, and thereby the mechanical properties of the solder joints weaken eventually.…”

Section: Interfacial Microstructurementioning

confidence: 99%

Investigation on the intermetallic compound layer growth of Sn–0.5Ag–0.7Cu–xGa/Cu solder joints during isothermal aging

Luo

Xue

Liu

2014

J Mater Sci: Mater Electron

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This work was focused on the influence of Ga on the thermal properties, microstructural evolution and interfacial morphology with aging treatment at 150°C of low-silver Sn-0.5Ag-0.7Cu (SAC) lead-free solder. The melting temperature of the SAC-Ga solder was decreased owing to the low melting point element Ga and the formations of intermetallic compound (IMC) and growth at the interfaces of SAC/Cu and SAC-0.5Ga/Cu were studied for different aging time ranging from 0 to 720 h. The results indicated that for both solders, the thickness of the IMC increased with aging time prolonging. However, compared with the interface of SAC/Cu, the thickness of the interface of SAC-Ga/Cu was obviously suppressed and the growing speed was slowed down, which may be attributed to the decreased activity of copper atoms by Ga addition, so that the SAC-Ga solder showed relatively planar-like IMC instead of scallop-like at the interface.

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“…e SAC0307 and other SAC solders nevertheless are plagued with low fatigue strength and creep resistance [5][6][7][8]. To mitigate, certain small particles were introduced into the solder to transform it into a composite material such that the movement of dislocations and the grain boundary slidings were hindered [6,7,9]. Importantly, with the advancement in the nanotechnology, many new nanoparticles have been synthesized and used as the dispersed phases in the solders (i.e., the nanocomposite solders) to enhance their mechanical properties [10].…”

Section: Introductionmentioning

confidence: 99%

Effects of Zinc Oxide Nanoparticles on Properties of SAC0307 Lead‐Free Solder Paste

Kanlayasiri

Meesathien

2018

Advances in Materials Science and Engineering

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is research investigates the effects of zinc oxide (ZnO) nanoparticles of varying concentrations 0.0, 0.25, 0.50, 0.75, and 1.0 wt.% on the melting temperatures, wettability, printability, slump, and interfacial microstructure of the ZnO-doped Sn-0.3Ag-0.7Cu lead-free solder pastes on the copper substrate. e results revealed that the introduction of the ZnO particles had no effect on the solidus and liquidus temperatures of the solders. e maximum wettability was achieved with 0.25 wt.% ZnO nanoparticles, while the printability was inversely correlated with the nano-ZnO concentrations. e findings also indicated that, at room temperature, the slumping and the nano-ZnO concentrations were positively correlated and that, under the 150°C thermal condition, the maximum slumping was achieved with 0.25 wt.% ZnO. e slumping mechanism of the SAC0307-xZnO solder pastes is also provided herein. Moreover, the experiments showed that Cu 6 Sn 5 was the single intermetallic compound present in the interfacial layer between the solders and the copper substrate, with the maximum intermetallic layer thickness realized at the 0.25 wt.% ZnO concentration.

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Thermal analysis and mechanical properties of Sn–1.0Ag–0.5Cu solder alloy after modification with SiC nano-sized particles

Cited by 54 publications

References 17 publications

A study of Ag additive methods by comparing mechanical properties between Sn57.6Bi0.4Ag and 0.4 wt% nano-Ag-doped Sn58Bi BGA solder joints

A study of Ag additive methods by comparing mechanical properties between Sn57.6Bi0.4Ag and 0.4 wt% nano-Ag-doped Sn58Bi BGA solder joints

Investigation on the intermetallic compound layer growth of Sn–0.5Ag–0.7Cu–xGa/Cu solder joints during isothermal aging

Effects of Zinc Oxide Nanoparticles on Properties of SAC0307 Lead‐Free Solder Paste

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