Investigation on the intermetallic compound layer growth of Sn–0.5Ag–0.7Cu–xGa/Cu solder joints during isothermal aging

Luo, Dong-xue; Xue, Songbai; Liu, Shuang

doi:10.1007/s10854-014-2288-1

Cited by 14 publications

(4 citation statements)

References 22 publications

(25 reference statements)

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“…Ga can be easily enriched on the surface of the Sn-Pb solder liquid surface and form a dense protective film to improve the oxidation resistance of the solder [6,7]. Similarly, in this paper, Ga is added into the solder to ameliorate such problems.…”

Section: Introductionmentioning

confidence: 96%

Effect of Ga on the Inoxidizability and Wettability of Sn-0.5Ag-0.7Cu-0.05Pr Solder

Xue

Luo

et al. 2017

Advances in Materials Science and Engineering

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The effect of trace amount of Ga on the inoxidizability and wettability of Sn-0.5Ag-0.7Cu-0.05Pr solders was investigated systematically by means of microstructure characterizations. The results indicate that the wettability and oxidation resistance properties are remarkably improved with addition of trace amount of Ga. Moreover, it is observed that the trace amount of Ga in Sn-0.5Ag-0.7Cu-0.05Pr solders refines the matrix microstructure. The relationship between wettability and oxidation resistance was put into deep study. And Ga was found to be enriched on the surface of the molten solder, which benefited the properties correspondingly. The results of this study can stimulate the use of low-silver Sn-Ag-Cu-Pr solders for various applications.

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Section: Introductionmentioning

confidence: 96%

Effect of Ga on the Inoxidizability and Wettability of Sn-0.5Ag-0.7Cu-0.05Pr Solder

Xue

Luo

et al. 2017

Advances in Materials Science and Engineering

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“…But there are some disturbing issues about the new generation of solder. Firstly, the content of Ag is a key factor which restricts the application of SAC solders [3]. The solder joints fatigue strength can be improved with the addition of Ag, meanwhile the resistivity and melting point will reduce.…”

Section: Introductionmentioning

confidence: 99%

Effects of trace amount praseodymium and neodymium on microstructure and mechanical properties of Sn–0.3Ag–0.7Cu–0.5Ga solder

Han

Xue

Yang

et al. 2015

J Mater Sci: Mater Electron

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The effects of trace mount of rare earth elements Pr and Nd addition on Sn-0.3Ag-0.7Cu-0.5Ga lead free solder were investigated by observation of microstructure and the morphology of interface layer, as well as the test of shearing strength of the solder joints. The results show that the microstructure of the solder matrix can be optimized by appropriate addition of Pr and Nd, but the scalloped and ''region-like'' compounds (IMCs) appear in the solder matrix with excessive Pr and Nd addition respectively which may result in the stress concentration and become the birthplace of the cracks. The behavior of absorption of rare earth elements can retard the interface reaction between solder and Cu substrate, refine the morphology of the interface layer. The shearing strength of the solder joints can be enhanced better with appropriate addition of Pr than Nd by improvement of nucleation rate and control of growth rate of the grains near the interface layer.

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“…It is generally difficult to observe; thus, the analysis of this IMC growth needs to be done under large magnification. The soldered alloy for Sn3Ag0.5Cu also showed that only 6 5 was present at the joint, and this is most probably because of Cu having higher diffusivity in Sn as compared to Ag (Luo, Xue & Liu, 2014). Furthermore, using OSP substrate would provide more Cu atoms from the PCB simultaneously.…”

Section: Imc Formation: Sn-osp/enigmentioning

confidence: 98%

“…With Ga addition into the solder, the IMC growth was significantly slowed down. The thickness of IMC was affected by the diffusion of Cu and Ni as substrates, in which the activities of Cu and Ni atoms were halted due to the presence of Ga that formed new IMC phase (Luo, Xue & Liu, 2014).…”

Section: Imc Formation: Sn-osp/enigmentioning

confidence: 99%

Microstructure Control of Sn-based Alloys for Lead-free Solder as Microelectronic Interconnect Application

Mazlan¹

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Use of leaded solder was an issue in human health a few years back, while lead-free solders developed recently possesses higher melting temperature than conventional leaded solders. Thus, further research to develop more Sn-based solders with low-eutectic temperatures as compared to existing alloys are required. In this study, the effects of Gallium addition to five Sn-based alloys (Sn, SAC, Sn100C, Sn100CV, Sn-0.7Cu) at three different concentrations (0wt%Ga, 0.1wt%Ga and 2.0wt%Ga) was investigated. The microstructures of these alloys and the nature of their interactions with substrates including Electroless Nickel Immersion Gold (ENIG) and Organic Solderability Preservative (OSP) finishes is discussed.Thermal Analysis was done to investigate the resulting nucleation temperature of each alloy. The Sn-based alloys with 2.0wt% Ga additions had a reduction of 2℃-7℃ in growth temperatures when compared to their solidus temperatures. This matches the prediction from Sn-Ga phase diagram from previous studies. The intermetallic layers that formed between the solder and substrate showed that 0.1wt% Gallium resulted in a reaction with both Copper OSP and Nickel ENIG substrates, but higher concentrations of Ga (2.0wt%) did not result in a reaction at the interface. The microstructure analysis also showed that cracks formed in the cast specimens containing Ga and the solder balls appeared to have poorer wettability with increased Ga content. Both results suggested that there is segregation of Ga due to its low melting point, inducing low melting phase during solidification.In conclusion, the results indicate there is a critical composition of Ga which produces a homogeneous reaction with the alloys to assist in the fabrication of solder balls. Further studies on the properties of Ga containing alloys are required to fully understand the commercial potential.

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Investigation on the intermetallic compound layer growth of Sn–0.5Ag–0.7Cu–xGa/Cu solder joints during isothermal aging

Cited by 14 publications

References 22 publications

Effect of Ga on the Inoxidizability and Wettability of Sn-0.5Ag-0.7Cu-0.05Pr Solder

Effect of Ga on the Inoxidizability and Wettability of Sn-0.5Ag-0.7Cu-0.05Pr Solder

Effects of trace amount praseodymium and neodymium on microstructure and mechanical properties of Sn–0.3Ag–0.7Cu–0.5Ga solder

Microstructure Control of Sn-based Alloys for Lead-free Solder as Microelectronic Interconnect Application

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