Theory of Sputtering. I. Sputtering Yield of Amorphous and Polycrystalline Targets

Sigmund, Peter

doi:10.1103/physrev.187.768

Cited by 298 publications

(174 citation statements)

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“…At particle energies between 10 2 and 10 4 eV, the irradiation process is dominated by the nuclear collision cascade caused by impact 12,13 . Displaced atoms that reach the surface with enough kinetic energy to leave are permanently sputtered away; all other displaced atoms come to rest within the solid or on the surface after phonon emission times of ~10 − 12 s. These processes contribute prompt erosive 14,15 and prompt redistributive 11,16,17 components of morphology evolution and are collectively denoted P [x].…”

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confidence: 99%

Molecular dynamics of single-particle impacts predicts phase diagrams for large scale pattern formation

et al. 2011

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Energetic particle irradiation can cause surface ultra-smoothening, self-organized nanoscale pattern formation or degradation of the structural integrity of nuclear reactor components. A fundamental understanding of the mechanisms governing the selection among these outcomes has been elusive. Here we predict the mechanism governing the transition from pattern formation to flatness using only parameter-free molecular dynamics simulations of single-ion impacts as input into a multiscale analysis, obtaining good agreement with experiment. our results overturn the paradigm attributing these phenomena to the removal of target atoms via sputter erosion: the mechanism dominating both stability and instability is the impact-induced redistribution of target atoms that are not sputtered away, with erosive effects being essentially irrelevant. We discuss the potential implications for the formation of a mysterious nanoscale topography, leading to surface degradation, of tungsten plasma-facing fusion reactor walls. Consideration of impact-induced redistribution processes may lead to a new design criterion for stability under irradiation.

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Molecular dynamics of single-particle impacts predicts phase diagrams for large scale pattern formation

et al. 2011

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“…In CSE variation of sputter yield with ion angle of incidence is the key factor that enables erosional sharpening 21 , but is insuffi cient for producing sharp tips on the atomic-scale. Th is limitation is overcome by FDSS, in which a positive probe bias is applied producing a repulsive potential and localized electric fi eld enhancement at the apex, such that impinging ions are defl ected and the eff ective ion energy upon impact, landing voltage, is the off set between accelerating voltage and probe bias.…”

Section: Fdss Methodologymentioning

confidence: 99%

Field-directed sputter sharpening for tailored probe materials and atomic-scale lithography

et al. 2012

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Fabrication of ultrasharp probes is of interest for many applications, including scanning probe microscopy and electron-stimulated patterning of surfaces. These techniques require reproducible ultrasharp metallic tips, yet the effi cient and reproducible fabrication of these consumable items has remained an elusive goal. Here we describe a novel biased-probe fi elddirected sputter sharpening technique applicable to conductive materials, which produces nanometer and sub-nanometer sharp W, Pt-Ir and W-HfB 2 tips able to perform atomic-scale lithography on Si. Compared with traditional probes fabricated by etching or conventional sputter erosion, fi eld-directed sputter sharpened probes have smaller radii and produce lithographic patterns 18 -26 % sharper with atomic-scale lithographic fi delity.

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“…A surface atom at r = (x, y, h) is eroded with a probability proportional to the deposited energy E arising from the stopped ion. The spreading of energy is described by an anisotropic Gaussian [9] …”

Section: Continuum Theory and Monte Carlo Modelmentioning

confidence: 99%

Surfactant Sputtering: Theory of a new method of surface nanostructuring by ion beams

Kree

Yasseri

Hartmann

2009

Nuclear Instruments and Methods in Physics Research Section B:

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We present a new Monte Carlo model and a new continuum theory of surface pattern formation due to "surfactant sputtering", i.e. erosion by ion-beam sputtering including a submonolayer coverage of additional, cosputtered surfactant atoms. This setup, which has been realized in recent experiments in a controlled way leads to a number of interesting possibilities to modifiy pattern forming processing conditions. We will present three simple scenarios, which illustrate some potential applications of the method. In all three cases, simple Bradley-Harper type ripples appear in the absence of surfactant, whereas new, interesting structures emerge during surfactant sputtering.

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Theory of Sputtering. I. Sputtering Yield of Amorphous and Polycrystalline Targets

Cited by 298 publications

References 0 publications

Molecular dynamics of single-particle impacts predicts phase diagrams for large scale pattern formation

Molecular dynamics of single-particle impacts predicts phase diagrams for large scale pattern formation

Field-directed sputter sharpening for tailored probe materials and atomic-scale lithography

Surfactant Sputtering: Theory of a new method of surface nanostructuring by ion beams

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