Theory of beam-induced substrate heating

Groves, Timothy R.

doi:10.1116/1.588678

Cited by 23 publications

(12 citation statements)

References 5 publications

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“…5 In prior work there have been different simplifications to facilitate computation for multilayer structures. One is to neglect the resist layer and assume that the resist temperature is the same as the surface temperature of substrate; [6][7][8] another is to assume that the substrate is an ideal heat sink. 9 Those different assumptions lead to very different results.…”

Section: Introductionmentioning

confidence: 99%

Submicron thermocouple measurements of electron-beam resist heating

Chu¹,

Bilir²,

Pease³

et al. 2002

Journal of Vacuum Science &Amp; Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena

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Pattern distortion caused by resist heating is believed to contribute significantly to errors in feature size and pattern placement. A number of models have been proposed to predict the temperature rise of resist heating but experimental results are scarce. We fabricated and calibrated thin film gold/nickel thermocouples with (400 nm)2 junction size and used these to measure work-piece heating during electron-beam exposure. Irradiation by a 15 kV electron beam of 600 nA and 2 μm radius caused a temperature rise of 70 K, about 15% lower than the calculated result. The discrepancy may be due to the differences between the energy deposition profiles used in modeling and those prevailing in the experiments.

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Section: Introductionmentioning

confidence: 99%

Submicron thermocouple measurements of electron-beam resist heating

Chu¹,

Bilir²,

Pease³

et al. 2002

Journal of Vacuum Science &Amp; Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena

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“…[8][9][10][11][12] Based on different simplifications, these models lead to very different results. [8][9][10][11][12] Based on different simplifications, these models lead to very different results.…”

Section: Introductionmentioning

confidence: 99%

Measurement of resist heating in photomask fabrication

Babin¹

1997

Journal of Vacuum Science &Amp; Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena

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Articles you may be interested inImproved etch resistance of ZEP 520A in reactive ion etching through heat and ultraviolet light treatmentThe use of a Si-based resist system and Ti electrode for the fabrication of sub-10 nm metal-insulator-metal tunnel junctions Application of poly(methyl methacrylate) ultrathin resist supported by a flowing subphase method in electronbeam fabrication of a 4 in. high-resolution mask High-throughput photomask fabrication using 50 kV variably shaped electron-beam lithography was examined for resist heating distortions. Effective absorbed energy changes in the resist due to heating were measured using beam current density and subfield time sequences as parameters. Absorbed energy changes due to short-range heating inside a subfield were also determined. Corresponding linewidth variations caused by resist heating were measured. This showed that the 1 m gaps had become completely broken. The sublimation of resist during exposure was investigated, and the subsequent reduction in resist thickness was measured as a function of exposure dose. The highly sensitive resist PBS ͓poly͑butene-1 sulfone͔͒, which is used widely for photomask manufacturing, was used for the heating measurements. It was concluded that high-throughput variably shaped electron-beam lithography with a high current density (20-80 A/cm 2 ) may not be suitable for reticle fabrication without taking precautions for heating effects.

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“…This clearly has a direct and significant influence on the final mask cost. As previously described, the migration of mask-writing tools to higher accelerating voltages necessitates higher sensitivity both to improve production throughput and reduce beam-induced resist heating [42,43]. Our current research is involved in optimizing the sensitivity of this resist by modification of the radiationactive component.…”

Section: Sensitivitymentioning

confidence: 97%

Recent progress in electron-beam resists for advanced mask-making

et al. 2001

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Resists for advanced mask-making with highvoltage electron-beam writing tools have undergone dramatic changes over the last three decades. From PMMA and the other early chain-scission resists for micron dimensions to the aqueous-base-developable, dry-etchable chemically amplified systems being developed today, careful tuning of the chemistry and processing conditions of these resist systems has allowed the patterning of photomasks of increasing complexity containing increasingly finer features. Most recently, our research efforts have been focused on a low-activation-energy chemically amplified resist based on ketal-protected poly(hydroxystyrene). These ketal resist systems, or KRSs, have undergone a series of optimization and evaluation cycles in order to fine-tune their performance for advanced mask-fabrication applications using the 75-kV IBM EL4؉ vector scan e-beam exposure system. The experiments have led to an optimized formulation, KRS-XE, that exhibits superior lithographic performance and has a high level of processing robustness. In addition, we describe advanced formulations of KRS-XE incorporating organometallic species, which have shown superior dry-etch resistance to novolak-based resists in the Cr etch process while maintaining excellent lithographic performance. Finally, current challenges facing the implementation of a chemically amplified resist in the photomask manufacturing process are outlined, along with current approaches being pursued to extend the capabilities of KRS technology.

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Theory of beam-induced substrate heating

Abstract: Articles you may be interested inFacet and bulk heating of GaAs/AlGaAs high-power laser arrays studied in spatially resolved emission and micro-Raman experiments

Cited by 23 publications

References 5 publications

Submicron thermocouple measurements of electron-beam resist heating

Submicron thermocouple measurements of electron-beam resist heating

Measurement of resist heating in photomask fabrication

Recent progress in electron-beam resists for advanced mask-making

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