Theoretical Investigation of Temperature-Gradient Induced Glass Cutting

One-Step Femtosecond Laser Stealth Dicing of Quartz

“…The fracture mechanism is similar to a crack extension, which can deviate from the desired path, especially for fast cutting speeds and long cutting lengths [11]. After being optimized in order to control the path of the stress-induced fracture, such a technique has been successfully applied to cut various materials, including silicon [21], alumina ceramics [22] and glass [23]. Xu et al [19] demonstrated the laser thermal cleavage of sapphire substrate wafers using a CO 2 laser source.…”

“…The generation of such microcracks was ascribed to the damage induced by filamentation and the consequent mechanical stress built-up in the material. Moreover, many studies have explored multifocal laser processing, mainly using a combination of diffractive optical elements (i.e., Fresnel lens) and Bessel beams [22,23]. Tsai et al [28] demonstrated the cutting of a thin glass with a thickness of 100 µm through modification in the bulk volume, using a femtosecond laser Bessel beam and applying a breaking stress.…”