Theoretical and experimental analysis of material deformation by microcontact

The wire saw process is widely used for silicon wafer production with high yield and low surface damage in solar cell and microelectronics industries. The wire saw process is used to machine brittle materials in the ductile regime where high yield and low surface damage are desired. The wire saw process is also used to cut concrete and rocks in civil engineering. In this study, an experimental parametric study was conducted by varying process parameters to determine surface roughness damage. Ductile regime material removal by trans-granular failure and brittle fracture by inter-granular failure are observed in electron micrographs of the cut surfaces. A damage model that relates the roughness damage to process parameters was derived. The damage model predicts the roughness damage satisfactorily. The model shows that the roughness damage is proportional to the ratio of feed speed to wire speed. Improvement in the efficiency of the process without increasing the roughness damage can be attained by increasing the feed speed proportionally to wire speed. Wire tension does not affect roughness damage. Roughness damage, however, is affected by properties of the wire. Wires having smaller grit radius and small grit spacing cause less roughness damage.

Section: Introductionmentioning

confidence: 99%

Roughness damage evolution due to wire saw process

Teomete

2011

“…Imprinting lithography describes the general process of using a mold, template or stamp to produce a pattern by replication, which could be categorized as 'molding and embossing' and 'transfer printing'. 1,2 Molding and embossing includes hot embossing, nanoimprinting, 3-5 step and flash imprint, 6 and UV-imprinting, 7,8 whereas micro-and nano-contact printing 9,10 are termed transfer printing processes. Hot embossing and nanoimprinting use thermal reflow under high temperature and high pressure conditions, whereas UV-imprinting uses UV curing of lowviscosity monomer or polymer at room temperature and low pressure.…”

Section: Introductionmentioning

confidence: 99%

Micropatterning on roll surface using photo-lithography processes

Kim

2011

A direct patterning for a barrier rib using the roll-imprinting process is getting more interests in display manufacturing fields. Master roll patterning is one of the important issues in the roll-imprinting process. In this study, a novel fabrication process of micro-patterning on a roller surface by applying the photolithography process is studied. Because the roller surface was a cylindrical shape, the designed pattern was made by using a film mask. Special jigs and roll holder were designed and used for the photolithography on the roll substrate. The roll patterning results showed a feasibility of the proposed method for the photolithography on the roll's surface.

“…Micro or nanometer patterns are obtained by imprinting a pre-patterned mold into a substrate by transferring the patterns using UV curable resin. [11][12][13][14][15][16][17][18][19] In these applications, the interfacial energy between the hard/soft material layers is considered to be the significant factor in determining the characteristics of the laminate system for various applications. It has been proposed that the interfacial energy is the controlling parameter for tailoring the properties of the entire laminate system.…”

Section: Introductionmentioning

confidence: 99%

Characterizations of the interfacial energy in glass/resin laminates

Park

Kim

Yim

et al. 2011

Self Cite

A study is made of the characterization of the interfacial energy in glass/resin laminates by tensile and flexural tests. Glass/resin laminates, such as slide glass/resin/slide glass, LCD glass/resin/slide glass, and LCD glass/resin/silicon wafer layer structures, are constructed. The effects of the lubricant, mold/substrate materials and resin thickness on the interfacial energy are investigated. The application of lubricant in the laminates critically reduces the interfacial energy during the demolding process. The interfacial energy is determined not only by the mold/resin interface but also by the resin/substrate interface. Although the interfacial energy is influenced by increased surface of micro-sized patterns, the patterns are conserved after the mold is demolded by the introduction of lubricant. A higher interfacial energy increases the adhesive force between the mold and the resin when the resin is thinner, indicating the need for lubricant. In contrast, thinner resin is profitable for designing strong laminate applications.