Theoretical analysis on thermal grease dry-out degradation in space environment

Jiang, Zhiyuan; Li, J.Y.; Qu, Zechao; Wang, L.; Miao, Jun

doi:10.1016/j.ijthermalsci.2022.107694

Cited by 12 publications

(1 citation statement)

References 26 publications

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“…Conventional heat transfer techniques such as thermal silicone grease [11][12][13] , composite ller materials 14,15 , thermal gel 16,17 , heat pipe [18][19][20][21][22] , and graphite sheets [23][24][25] have been well developed. They mainly rely on isotropic heat conduction and convection, which cannot arbitrarily manipulate heat ow along a designed path.…”

Section: Introductionmentioning

confidence: 99%

Ultrafast unidirectional on-chip heat transfer

Jia

Yang

Liu

et al. 2023

Preprint

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Effective and rapid heat transfer is critical to improving electronic components' performance and operational stability, particularly for miniaturized devices with high heat dissipation demands. However, current thermal manipulation approaches, including the recent advancement in thermal metamaterials, cannot realize fast and unidirectional control of the heat flow path. In addition, any defects in thermal conductive materials cause a significant decrease in thermal conductivity, severely degrading heat transfer performance. Here, we demonstrate a new approach to achieve ultrafast unidirectional on-chip heat transfer. Using silicon-based valley photonic crystals (VPCs), we have realized robust unidirectional heat transfer through thermal radiation in the infrared wavelength region. This approach can facilitate heat transfer through arbitrarily designed heat flow paths with near-unity heat transmission efficiency independent of temperature. Furthermore, the design exhibits defect immune heat transfer capability due to the unique properties of VPC structures. It opens new possibilities in heat transfer without the inherent limitations of conventional conductive heat transfer mechanism, which inevitably heats up the entire devices, causing severe performance degradation and energy waste. The design is fully CMOS compatible, thus, will find broad applications, particularly in heat dissipation for integrated optoelectronic devices.

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Section: Introductionmentioning

confidence: 99%

Ultrafast unidirectional on-chip heat transfer

Jia

Yang

Liu

et al. 2023

Preprint

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High‐Yield‐Stress Particle‐Stabilized Emulsion for Form‐Factor‐Free Thermal Pastes with High Thermal Conductivity, Stability, and Recyclability

Min,

Jo,

Ryu

et al. 2023

Adv Materials Inter

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Thermal pastes, thermally conductive fillers dispersed in liquid matrices, are widely used as thermal interface materials (TIMs). TIMs transfer heat generated from electronics to the surroundings, ensuring optimal operating temperatures. Thus, it is crucial to obtain high thermal conductivity (TC) by forming a continuous heat‐conduction pathway through interconnected filler‐networks within the TIM. Therefore, for paste‐type TIMs with spherical fillers, high TC can only be realized at sufficiently high filler loadings (>60 vol%). However, the pastes bearing such high filler loadings are thick, stiff, and less applicable. To these ends, particle‐stabilized emulsions composed of immiscible liquids (silicone oil and glycerol) and spherical alumina are utilized as thermal pastes. Owing to this structure, the resulting form‐factor‐free thermal paste exhibits higher TC and stability than a simple mixture consisting of alumina and a single‐liquid‐matrix (either silicone oil or glycerol). Furthermore, the high applicability of the emulsion‐type pastes enables syringe extrusion, 3D printing, multiple cycles of reprocessing/molding, and eco‐friendly recycling.

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Ultrafast Unidirectional On‐Chip Heat Transfer

Yang,

Liu,

Wang

et al. 2024

Small

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Effective and rapid heat transfer is critical to improving electronic components' performance and operational stability, particularly for highly integrated and miniaturized devices in complex scenarios. However, current thermal manipulation approaches, including the recent advancement in thermal metamaterials, cannot realize fast and unidirectional heat flow control. In addition, any defects in thermal conductive materials cause a significant decrease in thermal conductivity, severely degrading heat transfer performance. Here, the utilization of silicon‐based valley photonic crystals (VPCs) is proposed and numerically demonstrated to facilitate ultrafast, unidirectional heat transfer through thermal radiation on a microscale. Utilizing the infrared wavelength region, the approach achieves a significant thermal rectification effect, ensuring continuous heat flow along designed paths with high transmission efficiency. Remarkably, the process is unaffected by temperature gradients due to the unidirectional property, maintaining transmission directionality. Furthermore, the VPCs' inherent robustness affords defect‐immune heat transfer, overcoming the limitations of traditional conduction methods that inevitably cause device heating, performance degradation, and energy waste. The design is fully CMOS compatible, thus will find broad applications, particularly for integrated optoelectronic devices.

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Theoretical analysis on thermal grease dry-out degradation in space environment

Cited by 12 publications

References 26 publications

Ultrafast unidirectional on-chip heat transfer

Ultrafast unidirectional on-chip heat transfer

High‐Yield‐Stress Particle‐Stabilized Emulsion for Form‐Factor‐Free Thermal Pastes with High Thermal Conductivity, Stability, and Recyclability

Ultrafast Unidirectional On‐Chip Heat Transfer

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