The variation of work-hardening characteristics of Al–1wt% Si and Al–1wt% Si–0.1wt% Zr–0.1wt% Ti alloys

Evolution of Thermo-mechanical Properties of Aluminium-Silicon Alloy (Al-1wt%Si)

“…This decrease in hardness, or softening of the alloy, is reflected through the observed decrease in the hardening parameters σ f , σ y and χ and an increase in ε f given in Figure 1. The thermally induced internal structure of the alloy in the tested temperature range which leads to the observed hardening behavior up to 525 K after which a softening behavior dominates, consists with previous studies [1][2][3][4][5][6][7][8][9][10][11][12][13][14].…”

“…In a quenched Al-Si alloy, the silicon precipitates nucleate on the vacancy clusters and dislocation loops [8]. The precipitates of Si become visible after the disappearance of the formed dislocation loops.…”

“…The nucleation of the precipitate of Si was enhanced by pre-ageing quenched specimens near the room temperature as a result of the existence of the dislocation loops formed by the condensation of the quenched alloy in vacancies [9]. Some other workers also carried out such properties of structure and mechanical properties of low silicon-aluminium alloys [7][8][9][10]. Both the strength and ductility of the alloy were functions of the size and distribution of the Si particles in the aluminium matrix [11].…”

Effect of Ag addition on the creep characteristics of Sn–8.8wt%Zn solder alloy

“…In order to determine the energy activating the transient creep process E tr , one can assume that values ofˇsatisfy the Arrhenius type form [18]:…”

Transformation characteristics of Al–Ag and Al–Ag–Ti alloys

“…Thus, it is reasonable to correlate the values obtained for the activation energy with processes that take place during aging and mainly the precipitation process. In this respect, the value of 25 ± 0.4 kJ/mol for low aging temperature region can be attributed to dislocation intersection mechanism [22]. At high temperatures the microstructure changes and coarsens allow the operating of thermally activated processes such as interface-dislocation interaction, reduction of interface density and dislocation glide.…”