The unbiased propagation mechanism in laser cutting silicon wafer with laser induced thermal-crack propagation

Cheng, Xing; Yang, Lijun; Wang, Maolu; Cai, Yecheng; Wang, Yang; Ren, Zhixing

doi:10.1007/s00339-019-2763-x

Cited by 9 publications

(4 citation statements)

References 14 publications

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“…However, a body heat source is mainly formed in transparent, brittle materials such as glass. For opaque, brittle materials, a thermogenic beam such as a laser beam can only be absorbed by the surface of the material to form a surface heat source [14][15][16][17]. Since the heat source is formed on a single surface of the material in these cases, this cutting mode is called the single-sided thermal stress method (SSTM).…”

Section: Figure 1)mentioning

confidence: 99%

Splitting Opaque, Brittle Materials with Dual-Sided Thermal Stress Using Thermal-Controlled Fracture Method by Microwave

Cheng

Wang

et al. 2022

Crystals

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The thermal-controlled fracture method has been increasingly focused upon in the high-quality splitting of advanced brittle materials due to its excellent characteristics related to the fact that it does not remove material. For opaque, brittle materials, their poor fracture quality and low machining capacity resulting from their single-sided heat mode is a bottleneck problem at present. This work proposed the use of dual-sided thermal stress induced by microwave to split opaque, brittle materials. The experimental results indicate that the machining capacity of this method is more than twice that of the single-sided heat mode, and the fracture quality in splitting opaque, brittle materials was significantly improved by dual-sided thermal stress. A microwave cutting experiment was carried out to investigate the distribution characteristic of fracture quality by using different workpiece thicknesses and processing parameters. A dual-sided thermal stress cutting model was established to calculate the temperature field and thermal stress field and was used to simulate the crack propagation behaviors. The accuracy of the simulation model was verified using temperature measurement experiments. The improvement mechanism of the machining capacity and fracture quality of this method was revealed using the fracture mechanics theory based on calculation results from a simulation. This study provides an innovative and feasible method for cutting opaque, brittle materials with promising fracture quality and machining capacity for industrial application.

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Section: Figure 1)mentioning

confidence: 99%

Splitting Opaque, Brittle Materials with Dual-Sided Thermal Stress Using Thermal-Controlled Fracture Method by Microwave

Cheng

Wang

et al. 2022

Crystals

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“…The fracture mechanism is similar to a crack extension, which can deviate from the desired path, especially for fast cutting speeds and long cutting lengths [11]. After being optimized in order to control the path of the stress-induced fracture, such a technique has been successfully applied to cut various materials, including silicon [21], alumina ceramics [22] and glass [23]. Xu et al [19] demonstrated the laser thermal cleavage of sapphire substrate wafers using a CO 2 laser source.…”

Section: Introductionmentioning

confidence: 99%

One-Step Femtosecond Laser Stealth Dicing of Quartz

2020

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We report on a one-step method for cutting 250-µm-thick quartz plates using highly focused ultrashort laser pulses with a duration of 200 fs and a wavelength of 1030 nm. We show that the repetition rate, the scan speed, the pulse overlap and the pulse energy directly influence the cutting process and quality. Therefore, a suitable choice of these parameters was necessary to get single-pass stealth dicing with neat and flat cut edges. The mechanism behind the stealth dicing process was ascribed to tensile stresses generated by the relaxation of the compressive stresses originated in the laser beam focal volume during irradiation in the bulk material. Such stresses produced micro-fractures whose controlled propagation along the laser beam path led to cutting of the samples.

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“…During the development of half a century, scholars in this community have carried out many experimental and theoretical research on monocrystalline silicon, polycrystalline silicon, glass/silicon two-layer bonding materials and some ceramics [10][11][12][13][14][15]. The main difference between these materials and glass is that they can't form a full-body cutting mode with the commonly used laser wavelength.…”

Section: Introductionmentioning

confidence: 99%

“…The main difference between these materials and glass is that they can't form a full-body cutting mode with the commonly used laser wavelength. During laser cutting silicon sheets (usually <0.5 mm) process, it is generally considered that laser produces a surface heat source with a negligible laser-absorption depth [12][13][14][15]. In other words, laser is absorbed at the surface of the silicon wafer, and the heat in the whole thickness is mainly generated by heat transfer.…”

Section: Introductionmentioning

confidence: 99%

Mechanism of irregular crack-propagation in thermal controlled fracture of ceramics induced by microwave

Cheng

Zhao

Wang

et al. 2020

Mechanics & Industry

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Microwave cutting glass and ceramics based on thermal controlled fracture method has gained much attention recently for its advantages in lower energy-consumption and higher efficiency than conventional processing method. However, the irregular crack-propagation is problematic in this procedure, which hinders the industrial application of this advanced technology. In this study, the irregular crack-propagation is summarized as the unstable propagation in the initial stage, the deviated propagation in the middle stage, and the non-penetrating propagation in the end segment based on experimental work. Method for predicting the unstable propagation in the initial stage has been developed by combining analytical models with thermal-fracture simulation. Experimental results show good agreement with the prediction results, and the relative deviation between them can be <5% in cutting of some ceramics. The mechanism of deviated propagation and the non-penetrating propagation have been revealed by simulation and theoretical analysis. Since this study provides effective methods to predict unstable crack-propagation in the initial stage and understand the irregular propagation mechanism in the whole crack-propagation stage in microwave cutting ceramics, it is of great significance to the industrial application of thermal controlled fracture method for cutting ceramic materials using microwave.

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The unbiased propagation mechanism in laser cutting silicon wafer with laser induced thermal-crack propagation

Cited by 9 publications

References 14 publications

Splitting Opaque, Brittle Materials with Dual-Sided Thermal Stress Using Thermal-Controlled Fracture Method by Microwave

Splitting Opaque, Brittle Materials with Dual-Sided Thermal Stress Using Thermal-Controlled Fracture Method by Microwave

One-Step Femtosecond Laser Stealth Dicing of Quartz

Mechanism of irregular crack-propagation in thermal controlled fracture of ceramics induced by microwave

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