The transfer of metallic contamination via contact between solid objects

Borde, Yannick; Danel, Adrien; Roche, Agnès; Brunon, Laetitia; Chevalier, Nicolas

doi:10.1016/j.mee.2008.09.048

Cited by 3 publications

(1 citation statement)

References 6 publications

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“…But the transfer of metallic contamination via solid contact (wafers on stage and robot) is an almost non documented topic. A. Danel and Y. Borde et al [11,12] have recently tackled this theme demonstrating that the contamination is transferred only when contaminants are under particle form, with an efficiency depending mainly on particle size. When gaseous contaminants are mixed in manufacturing environment, various problems can occur in manufacturing line.…”

Section: Advances In Contamination Managementmentioning

confidence: 99%

Cleanliness Management in Advanced Microelectronic

Borde

Danel²,

Roche

et al. 2009

SSP

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After technical results presented the last two years and new results on volatile contamination, this paper reviews the contamination management in advanced microelectronic and proposes rules for advanced Integrated Circuits (IC) manufacturing. The competitiveness of a production line is insured only if right contamination management rules are applied. These rules must allow a fast introduction of disruptive technologies while keeping as low as possible associated costs: processing on shared equipments, determination of acceptable levels of contamination with a good understanding of their detrimental impact on devices, knowledge on contamination dissemination mechanisms. Moreover, a control of contamination using appropriate cleanings and metrologies is mandatory.

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Section: Advances In Contamination Managementmentioning

confidence: 99%