The synergistic effect of micron spherical and flaky silver-coated copper for conductive adhesives to achieve high electrical conductivity with low percolation threshold

Zhang, Weiwei; Zhang, Luobin; Wang, Jianqiang; Zhang, Zheng; Wang, Jintao; Liu, Hao; Chen, Hongtao; Li, Mingyu

doi:10.1016/j.ijadhadh.2021.102988

Cited by 14 publications

(3 citation statements)

References 22 publications

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“…The conductive material can be classified as 0-dimensional (0D, NPs), ,− one-dimensional (1D, NWs), − two-dimensional (2D, graphene sheets, metallic nanoflakes), − and three-dimensional (3D, microparticles). − …”

Section: Introductionmentioning

confidence: 99%

Fabrication Approaches of Soft Electronics

Tan

Farraj

Kamyshny

et al. 2023

ACS Appl. Electron. Mater.

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The use of conductive materials to be printed/embedded onto/within a polymeric matrix has gained increasing attention in the fabrication of next-generation soft electronics. In this review, we provide a comprehensive overview of the materials and approaches for the fabrication of 2D and 3D conductive structures while focusing on the importance of the compatibility between the particles' shape, the polymeric matrix type, and the deposition method, along with the target application. The review presents a summary of the main conductive materials and the type of polymeric materials which were utilized for fabricating soft electronic devices that are bendable/twistable and stretchable. It is divided into two sections: Introduction section, which presents briefly conductive materials, polymeric matrix, and fabrication methods, and Fabrication section, presenting the main 6 approaches of fabrication. Each of the fabrication subsections presents the main recent reports in a detailed table. The review is concluded with an Outlook section, describing the current challenges in this field. Despite the progress in the fabrication of 2D bendable/twistable electronic devices toward industrial integration, there is still a need for tailoring and improving the durability and robustness of 3D stretchable electronic devices.

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Section: Introductionmentioning

confidence: 99%

Fabrication Approaches of Soft Electronics

Tan

Farraj

Kamyshny

et al. 2023

ACS Appl. Electron. Mater.

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“…Today, there is a growing demand for flexible, lightweight and inexpensive conductive materials. [1][2][3] For this reason, over the years many materials have been investigated, such as silicon/ gallium-based electronics and indium tin oxide (ITO). [4][5][6][7] Among them, electrically conductive polymer composites (ECPC) composed of polymer matrices and conductive fillers are a suitable option.…”

Section: Introductionmentioning

confidence: 99%

Effect of processing methods on the electrical conductivity properties of silver-polyurethane composite films (Experimental and numerical studies)

Mehvari,

Goodhew,

González

et al. 2023

Journal of Composite Materials

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This research investigates the electrical properties of micro silver polyurethane (Ag-PU) composite films with different degrees of agglomeration. Ag-PU composite films were prepared by adding micro silver particles (<3.5 μm) into the thermoplastic PU matrix using a solution mixing method, followed by spin-coating or casting techniques. For some composite preparation, the silver solution was shear-mixed in an ultrasonic bath before being added to the PU solution to obtain higher filler dispersion within the polymer matrix. This method produced several composite films with variable degrees of silver aggregation with concentrations from 0 to 14 vol%. All composites showed only electrical conductivity through thickness when compressed under pressure in a range from 0.5 to 20 kPa. Generally, the percolation threshold and conductivity values of the composite film prepared by spin-coating were lower than those of the casting composite. The maximum conductivity value found in these composites was about 2.45 S/m. All composites’ electrical performance was numerically simulated using the finite element analysis method based on the representative volume element model (FE-RVE) with Digimat software. A correlation was observed between the experiments and those simulations. A semi-analytical model was used to estimate the composite electrical parameters.

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“…Acid treatment is a common and effective method to develop copper-based ECAs, which adopts acids (e.g., phosphoric acid, sulfuric acid and oleic acid) as chemical etching agents to remove oxides from the copper surface. ,, The tidied copper powder is mixed with corrosion inhibitors, resins, etc., in a short time, an alleged antioxidant copper paste. There are few reports of long-term usage of the above pastes on account of insufficient protection strategies.…”

Section: Introductionmentioning

confidence: 99%