“…Similarly, although widely supported by the experimental results (see, for instance, ref and therein), the Landau–Levich theory has been unable to predict the thickness of ZnO thin films deposited by dip coating. , Currently, the occurrence of controversial results can mainly be explained by the systematic use of multi-dip processes (i.e., multi-layers), leading to fairly thick ZnO thin films and, correlatively, to cross-studied parameters. Furthermore, standard annealing processes have been shown to be insufficient owing to the resulting high porosity and roughness of ZnO thin films, for instance, limiting in turn their efficient integration as seed layers into ZnO NW-based devices. − The use of high-temperature annealing process has recently been applied to thick films deposited by dip coating through multi-dip processes to form strongly textured films. ,,,− , By combining multi-dip processes with an annealing temperature higher than 800 °C, the formation of thick films consisting of ZnO NPs with an average diameter of almost 200 nm has been reported. ,, In such processes, the film thickness or other parameters such as the solution concentration or the withdrawal speed may only affect slightly the ZnO film texture and its surface morphology. ,, However, despite their high potential, the use of multi-deposit films is strongly detrimental for their integration into ZnO NW-based devices owing to their large thickness and, correlatively, high roughness. The large film thickness can also enhance the optical absorption of these multi-deposit films when used in nanostructured solar cells, which should be avoided as much as possible.…”