The stored energy in processed Cu–0.4wt.%Cr–0.12wt.%Zr–0.02wt.%Si–0.05wt.%Mg

Study of microstrain in rapidly solidified structures of hypercooled Co80Pd20 alloys

“…From the sections on ‘Comparisons of specimens with the different undercoolings but the same cooling path’ and ‘Comparisons of specimens with the same undercooling but the different cooling paths’, it can be inferred that rapid solidification can lead to substantial microstrain/stress in the rapid solidification structure of the hypercooled alloy melts. The magnitude of residual microstrain in the microstructure ranges from ∼0·09 to 0·23%, which is comparable with the microstrain level of cold drawn copper alloy 16. Previous investigations showed that microstrain in high purity Cu samples processed by different approaches varied in a wide range, such as 0·1% in equal channel angular pressing Cu17 and 0·24% in magnetron sputtering Cu 18.…”

“…The magnitude of residual microstrain in the microstructure ranges from ,0?09 to 0?23%, which is comparable with the microstrain level of cold drawn copper alloy. 16 Previous investigations showed that microstrain in high purity Cu samples processed by different approaches varied in a wide range, such as 0?1% in equal channel angular pressing Cu 17 and 0?24% in magnetron sputtering Cu. 18 Thus, the residual microstrain in the microstructure of the present rapidly solidified Co 80 P 20 alloys is substantial.…”

A physically-based constitutive model for high temperature deformation of Cu-0.36Cr-0.03Zr alloy

“…Recently many investigations on CueCreZr system alloys mainly focused on the improvement of physical and mechanical properties of the alloys, such as strength and conductivity [14,15], ductility [16], thermal stability [17,18], hot deformation performance [19] and fatigue performance [20]. Based on compression tests on a gleeble 3500 in a wide range of temperatures and strain rates, this paper would investigate hot deformation behavior of Cu-0.36Cr-0.03Zr alloy and establish the physical-based constitutive model to describe the work hardening, dynamic recovery and dynamic softening behavior.…”

Post SPD Material's Recovery in Thermal Exposition

“…According to the authors [15], endothermal peaks can be attributed to the dissolution of solute clusters which are being formed in dislocation walls at low temperatures. First peak of the exothermal reaction is recognized in the interval of T peak_1 ∈ 282; 284 • C and T onset_1 ∈ 258; 267 • C, second one is recognized in the interval T peak_2 ∈ 494; 530.3 • C and T onset_2 ∈ 435; 449 • C. Next emerging exothermal peaks can be associated to the annihilation of defects and the precipitation of secondary particles during a recovery process [16]. The rst exothermal peak is associated to Cu 3 Zr or Cu 5 Zr precipitates and second exothermal peak is associated to Cr particles [14].…”