1972
DOI: 10.2307/338333
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The Shu'ubiyya in Al-Andalus: The Risala of Ibn Garcia and Five Refutations

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“…After top yoke fabrication and encapsulation by a bilayer of SiN x and TEOS, electrical contacts (Cu pads) were exposed using RIE. In some cases, an electroplated Ni + Au bilayer was then applied to C4 and wirebonding pads, for example in the case of those inductors which were evaluated by Columbia University after packaging them in conjunction with their 45-nm technology node test processor using a 2.5D chip stacking process (9). SEM cross-section images of two-turn inductors and the magnetic via region are displayed in Fig.…”
Section: Inductor Fabricationmentioning
confidence: 99%
“…After top yoke fabrication and encapsulation by a bilayer of SiN x and TEOS, electrical contacts (Cu pads) were exposed using RIE. In some cases, an electroplated Ni + Au bilayer was then applied to C4 and wirebonding pads, for example in the case of those inductors which were evaluated by Columbia University after packaging them in conjunction with their 45-nm technology node test processor using a 2.5D chip stacking process (9). SEM cross-section images of two-turn inductors and the magnetic via region are displayed in Fig.…”
Section: Inductor Fabricationmentioning
confidence: 99%
“…2; the coil was encapsulated with hard-baked resist dielectric, which allowed the top yoke to slope down towards the magnetic via region for improved magnetic performance. Magnetic properties of the electroplated yoke material will be described (including high frequency permeability measurements), along with the performance of various fabricated inductors [4,5].…”
mentioning
confidence: 99%