The Role of Microstructure in Thermal Fatigue of Pb-Sn Solder Joints

Morris, J. W.; Tribula, D.; Summers, T.; Grivas, D.

doi:10.1007/978-1-4615-3910-0_7

Cited by 59 publications

(15 citation statements)

References 27 publications

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“…The reliability of solder joint under thermomechanical fatigue loading has been extensively studied in recent years (Basaran and Tang, 2001;Basaran and Chandaroy, 1998;Chow and Wei, 1999;Dasgupta and Hu, 1992;Solomon, 1986;Solomon and Tolksdorf, 1996). Morris et al (1991) stated that the thermal fatigue of Pb/Sn eutectic solder was characterized by microstructural coarsening or phase growth in the fatigue region. Frear et al (1997) studied the microstructural evolution of the solder and suggested that grain size be a damage parameter to evaluate thermal fatigue lifetime.…”

Section: Introductionmentioning

confidence: 98%

Pb phase coarsening in eutectic Pb/Sn flip chip solder joints under electric current stressing

Hua¹,

Basaran²,

Hopkins³

2004

International Journal of Solids and Structures

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Section: Introductionmentioning

confidence: 98%

Pb phase coarsening in eutectic Pb/Sn flip chip solder joints under electric current stressing

Hua¹,

Basaran²,

Hopkins³

2004

International Journal of Solids and Structures

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“…In the usual as-cast condition, the Sn-Pb eutectic has the classic lamellar eutectic microstructure: the bulk material is divided into grainlike "colonies" in which thin lamellae of Pb and Sn alternate. [55][56][57] The superplastic mechanism does not appear in lamellar material. However, if this structure is deformed and recrystallized, the lamellae are replaced by a mixture of fine, equiaxed grains of Sn and Pb (the recrystallized microstructure).…”

Section: Creep Of Eutectic Sn-pbmentioning

confidence: 98%

The correlation between stress relaxation and steady-state creep of eutectic Sn-Pb

Bang

Jung

et al. 2005

Journal of Elec Materi

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This paper surveys and compares creep and stress relaxation data on finegrained eutectic Sn-Pb. It examines the consistency of the available data on this extensively studied solder material and studies whether stress relaxation offers a reasonable alternative to the more laborious conventional creep tests. The data survey reveals systematic differences between the creep behavior of material that is grain-refined by cold work and recrystallization ("recrystallized") and that refined by rapid solidification ("quenched"). The recrystallized material has the conventional three regimes of creep behavior: a high-stress region with a stress exponent, n ϳ 4-7 and an activation energy Q ϳ 80 kJ/ mole (a bit below that for self-diffusion of Pb and Sn), an intermediate region with n ϳ 2 and Q ϳ 45 kJ/mole (near that for grain boundary diffusion), and a low-stress region with n ϳ 3 and Q ϳ 80 (suggesting a reversion to a bulk mechanism). The quenched material shows only two regions: a high-stress creep with a stress exponent, n ϳ 3-7, and a low-stress region with n ϳ 3. The mechanisms in both regimes have activation energies intermediate between bulk and interface values (50-70 kJ/mole). With minor exceptions, the stress relaxation data and the creep data are in reasonable agreement. Most of the exceptions seem to be related to the difficulty of capturing the full details of grain boundary creep in stress relaxation tests.

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“…[16,17] The miniaturization of solder joints raises two commonly neglected issues that need to be addressed in order to design reliable packages. [18] First, when the solder joint is very small the microstructural features that govern its mechanical behavior (such as the mean grain size and thickness of interfacial intermetallics) may be large with respect to the size of the joint. If the joint contains only a few grains it is not obvious if its mechanical behavior can be predicted from conventional mechanical tests, and there may be a considerable variation in behavior from joint to joint.…”

Section: Miniaturization In Joint Geometrymentioning

confidence: 99%

Microstructural evolution of eutectic Au-Sn solder joints

Song

2002

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Current trends toward miniaturization and the use of lead(Pb)-free solders in electronic packaging present new problems in the reliability of solder joints. This study was performed in order to understand the microstructure and microstructural evolution of small volumes of nominally eutectic Au-Sn solder joints (80Au-20Sn by weight), which gives insight into properties and reliability. The study particularly concentrated on the effects that the joint size and the type of substrate metallization have on both the bulk and interface microstructures of the joints. The systems studied were eutectic Au-Sn on Cu and Cu/electroless Ni/Au and for each system, two sets of sample geometries were used. The solubility characteristics and diffusional behavior of substrate metals into eutectic Au-Sn solder determines the detailed microstructure and microstructural evolution of the ultrafine eutectic Au-Sn joints. Two important things to be noted from the results are as follows: First, the overall microstructures of these joints are very coarse with respect to the size of joint, and hence the properties of the joints cannot be assumed from bulk solder data. Second, despite having a nominally similar starting eutectic Au-Sn composition, the microstructural features of the joints are unique for a given substrate metallization. Both of these results should be take into consideration during the design of reliable eutectic Au-Sn solder joints.

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The Role of Microstructure in Thermal Fatigue of Pb-Sn Solder Joints

Cited by 59 publications

References 27 publications

Pb phase coarsening in eutectic Pb/Sn flip chip solder joints under electric current stressing

Pb phase coarsening in eutectic Pb/Sn flip chip solder joints under electric current stressing

The correlation between stress relaxation and steady-state creep of eutectic Sn-Pb

Microstructural evolution of eutectic Au-Sn solder joints

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