“…In this respect, wafer‐scale thin‐film growth methods, such as CVD or molecular beam epitaxy (MBE), are preferable to realize device applications. Many research groups have reported thermal CVD of BN thin films with a wide variety of boron precursors, such as borazine (B 3 N 3 H 6 ), boron‐halides (BF 3 , BCl 3 , and BBr 3 ), and triethyl boron ((C 2 H 5 ) 3 B, TEB), on sapphire, SiC, Ni, and Cu substrates. For borazine, it is difficult to control the N/B ratio, which leads to turbostratic boron nitride ( t ‐BN), a disordered phase of h ‐BN.…”