1967
DOI: 10.1016/0021-9797(67)90228-7
|View full text |Cite
|
Sign up to set email alerts
|

The reaction of oleic acid with copper surfaces

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1
1

Citation Types

1
14
0

Year Published

1974
1974
2018
2018

Publication Types

Select...
5
1

Relationship

0
6

Authors

Journals

citations
Cited by 33 publications
(15 citation statements)
references
References 17 publications
1
14
0
Order By: Relevance
“…Furthermore, in the O 1s region (Figure S5, Supporting Information), there is a small peak at 530.7 eV, indicating that some of the oxygen is bonded to copper. These findings correlate with two options: the chemisorption of the oleic acid to the copper surface via the carboxylic group, forming ester‐like species or due to the presence of Cu 2 O. Characteristic peaks for CuO (Cu 2+ , 934 eV) were not found, indicating the absence of this surface oxide as in the case of the copper particles before milling (Figure S1B, Supporting Information).…”
Section: Resultsmentioning
confidence: 74%
See 3 more Smart Citations
“…Furthermore, in the O 1s region (Figure S5, Supporting Information), there is a small peak at 530.7 eV, indicating that some of the oxygen is bonded to copper. These findings correlate with two options: the chemisorption of the oleic acid to the copper surface via the carboxylic group, forming ester‐like species or due to the presence of Cu 2 O. Characteristic peaks for CuO (Cu 2+ , 934 eV) were not found, indicating the absence of this surface oxide as in the case of the copper particles before milling (Figure S1B, Supporting Information).…”
Section: Resultsmentioning
confidence: 74%
“…In order to form flakes, the obtained copper particles were milled with a solvent (dipropylene glycol monomethyl ether (DPM)) and oleic acid as the dispersing agent. DPM, which is widely used in ink formulations, was chosen because of its relatively low viscosity, while oleic acid is known to strongly bind to copper surfaces . The copper particles morphological transformation during milling is presented in Figure .…”
Section: Resultsmentioning
confidence: 99%
See 2 more Smart Citations
“…For example, a copper oleate peak appeared in the IR reflection spectrum within minutes after oleic acid was rubbed onto a copper surface (Low et al, 1967). As a second example, when a mixture of oleic, palmitic, and stearic acid was applied to copper, half of the fatty acids were converted to copper soaps within four days, and all the fatty acids were converted within four months (Schrenk, 1991).…”
Section: Background Informationmentioning
confidence: 99%