The laser-induced microbubble technique (LIMBT) has recently been developed for micro-patterning of various materials. In this method, a laser beam is focused on a dispersion of nanoparticles leading to the formation of a microbubble due to laser heating. Convection currents around the microbubble carry nanoparticles so that they become pinned to the bubble/substrate interface. The major limitation of this technique is that for most materials, a noncontinuous deposition is formed. We show that continuous patterns can be formed by preventing the microbubble from being pinned to the deposited material. This is done by modulating the laser so that the construction and destruction of the microbubble are controlled. When the method is applied to a dispersion of Ag nanoparticles, continuous electrically conductive lines are formed. Furthermore, the line width is narrower than that achieved by the standard nonmodulated LIMBT. This approach can be applied to the direct-write fabrication of micron-size conductive patterns in electronic devices without the use of photolithography.
Printing conducting copper interconnections on plastic substrates is of growing interest in the field of printed electronics. Photonic curing of copper inks with intense pulsed light (IPL) is a promising process as it is very fast and thus can be incorporated in roll-to-roll production. We report on using IPL for obtaining conductive patterns from inks composed of submicron particles of copper formate, a copper precursor that has a self-reduction property. Decomposition of copper formate can be performed by IPL and is affected both by the mode of energy application and the properties of the printed precursor layer. The energy application mode was controlled by altering three pulse parameters: duration, intensity, and repetitions at 1 Hz. As the decomposition results from energy transfer via light absorption, carbon nanotubes (CNTs) were added to the ink to increase the absorbance. We show that there is a strict set of IPL parameters necessary to obtain conductive copper patterns. Finally, we show that by adding as little as 0.5 wt % single-wall CNTs to the ink the absorptance was enhanced by about 50% and the threshold energy required to obtain a conductive pattern decreased by ∼25%. These results have major implications for tailoring inks intended for IPL processing.
Fabrication of devices by printing conductive interconnections on plastic substrates is of growing interest. Currently, silver flakes are wildly used, however the high cost of silver prevents their wide use in many electrical devices. A new two‐step process for synthesizing thin copper flakes, and their utilization in conductive inks, is reported. In the first step, sub‐micrometer copper particles are formed by thermal decomposition and self‐reduction of copper formate. These copper particles are then milled in a wet bead mill that results in their transformation into thin flakes with an average thickness of 48 nm. X‐ray diffraction results indicate that the copper particles undergo plastic deformation in a mechanism similar to cold rolling. The effect of various process parameters and type of dispersing agents on the morphology and electrical performance is studied. The ink formulations result in printed patterns with 22% of bulk copper conductivity. The optimal ink is used to print functioning near field communication antennas on polyimide film, which is found to have a high bending durability.
A new approach to fabricate copper, indium, gallium diselenide (CIGSe) solar cells on conductive fluorinedoped tin oxide (FTO) reached an efficiency of over 6% for a champion photovoltaic device. Commercial oxide nanoparticles are formulated into high-quality screen-printable ink based on ethyl cellulose solution in terpineol. The high homogeneity and good adhesion properties of the oxide ink play an important role in obtaining dense and highly crystalline photoabsorber layers. This finding reveals that solution-based screen-printing from readily available oxide precursors provides an interesting cost-effective alternative to current vacuum-and energy-demanding processes of the CIGSe solar cell fabrication.
There are conditions in clinical medicine demanding critical therapeutic decisions. These conditions necessitate accuracy, rapidity, accessibility, cost-effectiveness and mobility. New technologies have been developed in order to address these challenges. Microfluidics and Micro Electro-Mechanical Systems are two of such technologies. Microfluidics, a discipline that involves processing fluids at the microscale in etched microchannels, is being used to build lab- on-a-chip systems to run chemical and biological assays. These systems are being transformed into handheld devices designed to be used at remote settings or at the bedside. MEMS are microscale electromechanical elements integrated in lab chip systems or used as individual components. MEMS based sensors represents a highly developed field with successful commercialized products currently being incorporated into vitro,ex vivo and in vivo devices. In the present paper several examples of microfluidic devices and MEMS sensors are introduced together with some current examples of commercialized products. Future challenges and trends will be discussed.
We present a novel process to fabricate conductive patterns by a new copper precursor ink. In this method, an ink with copper formate, a self-reducible copper precursor, is printed, and subsequently heated under high pressure in a hot-press, which is commonly used in the printed circuit board industry. The heating leads to decomposition of the precursor, and results in copper patterns with good electrical conductivity. The application of pressure enables the formation of a dense copper film. 5-15 μm thick copper patterns were obtained on FR4 sheets with an equivalent specific resistivity as low as 5.3±0.3 μΩ cm, which is about three times the copper bulk resistivity. Unlike most methods for copper precursor inks, this ink and process do not require an inert environment, and can be performed with instrumentation already used in the industry. Finally, we demonstrate the applicability of this method by printing functional radio frequency components; i.e. antennas for near field communication and Wi-Fi.
The high usage of silver in industrial solar cells may limit the growth of the solar industry. One solution is to replace Ag with copper. A screen printable Cu paste is used herein to metallize industrial interdigitated back contact (IBC) solar cells. A novel metallization structure is proposed for making solar cells. Cu paste is applied to replace the majority of the Ag used in IBC cells as busbars and fingers. Cu paste is evaluated for use as fingers, and solar cells are made to test conversion efficiency and reliability. The Cu paste achieves comparably low resistivity, and Cu paste printed cells demonstrate similar efficiency to Ag paste printed cells, with an average efficiency of 23%, and only 4.5 mg W−1 of Ag usage. Also, the solar cells are stable and no Cu in‐diffusion is observed under damp heat (85 °C, 85% relative humidity) and thermal stress (200 °C) for 1000 h, respectively. All processes used in this study can be carried out with industrial equipment. These findings reveal a new application for Cu pastes and point to a new direction for reducing Ag utilization and cost.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.
hi@scite.ai
10624 S. Eastern Ave., Ste. A-614
Henderson, NV 89052, USA
Copyright © 2024 scite LLC. All rights reserved.
Made with 💙 for researchers
Part of the Research Solutions Family.