The periodic, electrochemical codeposition of cadmium and tellurium

Tobias, Charles W.

doi:10.1002/aic.690330411

Cited by 19 publications

(16 citation statements)

References 35 publications

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“…The CdTe deposition details are described by Panicker and co-workers [42], Fulop and co-workers [43], Gerritsen [44], and Sella and co-workers [45]. Verbrugge and Tobbias [46] provide a good overview of the deposition details associated with this material as well as an extensive list of references. Most CdTe electrodeposition makes use of an aqueous cadmium sulfate, tellurium dioxide, and sulfuric acid electrolyte and either cathodic of anodic methods may be employed.…”

Section: Cadmium Telluride (Cdte)mentioning

confidence: 99%

Electrodeposition of Semiconductors

Schlesinger

Rajeshwar

2010

Modern Electroplating

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Section: Cadmium Telluride (Cdte)mentioning

confidence: 99%

Electrodeposition of Semiconductors

Schlesinger

Rajeshwar

2010

Modern Electroplating

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“…ZkFDk and the initial condition c~(x, 0) = ck,~ [6] Equations 1-6 are solved subject to the condition that the total imposed current is equal to the sum of the partial currents for all electroactive species. During the on-time the total current is due to copper and nickel reduction ip = ieu + iN, [7] During the off-time i~ = 0 and /~ is equal to the partial current of copper (at open-circuit i~ = 0) g = i& [8] Equations i-8 are solved numerically using an algorithm presented in the Appendix.…”

mentioning

confidence: 99%

Effect of Corrosion on the Composition of Pulse‐Plated Cu‐Ni Alloys

Roy

Matlosz

Landolt

1994

J. Electrochem. Soc.

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Copper and nickel are codeposited by pulse and reverse-pulse plating on a rotating cylinder cathode from a citrate bath. Polarization data for copper and nickel as well as potential transients during pulse and reverse-pulse current experiments show that displacement reactions may occur during the pulse off-time or pulse-reversal time. A mathematical model which includes this effect is developed to predict the composition of electrodeposited alloys. The model shows that copper deposits at the mass-transfer limiting current throughout the pulse-cycle while nickel is alternately deposited and dissolved during the pulse on-time and off-time (or reversal time). The alloy composition is governed by pulse parameters and the diffusion limiting current for copper deposition.Due to the importance of pulsed currents in alloy electrodeposition, 1-4 a variety of investigations have focused on determining the fundamental relationships between applied pulse-parameters, governing physical phenomena (such as reaction kinetics and hydrodynamics), and the composition of the deposit. Verbrugge and Tobias~'6 proposed a theoretical model which could be used to calculate current-voltage relationships, metal ion concentration at the cathode, and deposit composition during the electroplating of a multicomponent alloy using periodic currents. Their model included the equation of convective diffusion to describe liquid-phase mass transfer at a rotating disk, Butler-Volmer expressions to calculate the rate of chargetransfer reactions at the electrode surface, and activities of individual metals in the solid-state to compute the composition of the deposit. They investigated numerically the effect of hydrodynamics, reactant concentration, reversible potentials, and solid-state activity on the deposit composition of a Cd-Te alloy. Pesco and Cheh 7 used a treatment similar to that of Verbrugge and Tobias, except that solidstate activities were neglected. They computed the composition of Pb-Sn alloys plated at a rotating disk electrode under mixed mass-transfer and kinetic control. Ruffoni and Landolt ~ investigated experimentally the variation in the composition of Au-Cu-Cd alloys as a function of applied pulse parameters and hydrodynamics. The results were compared with the prediction of a mathematical model which took into account the kinetic behavior of the three alloy components and hydrogen. 9 More recently White and co-workers ~~ have presented a theoretical model which includes the effects of migration on ion transport and of addition agents on reaction kinetics of the depositing metals.During pulse-plating of binary a11oys, the applied current is cycled between a high and a low or zero value. At high current density, both alloying dements are reduced at the cathode, but at low current density or at the opencircuit potential the less noble metal can be selectively dissolved or displaced from the alloy by the more noble one. n46 The numerical analysis of Verbrugge and Tobias 5 has already indicated that the more noble component may contin...

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“…The kinetic expressions appear as boundary conditions to these equations. The initial and boundary conditions for component 1 (NB) are Cl(0 , y) = C~ "lk [3] Cl(t, ar = C bulk [4] 0C1 (t, 0) il ----- [5] Oy n~FD1 positive in these equations. where, for high Schmidt numbers vy = -0.51023toa/2v-my2 [2] [The Schmidt number for nitrobenzene in the electrolyte used in this study is 6,100 and that for PHA is 13,000 (13).]…”

Section: Mathematical Modelmentioning

confidence: 99%

Reaction Selectivity Enhancement under Periodic‐Current Control: The Reduction of Nitrobenzene on the Rotating Disk Electrode

Nolen

Fedkiw

1990

J. Electrochem. Soc.

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Kinetic rate equations for the reduction of nitrobenzene have been used with a mathematical model for mass transfer to a rotating disk electrode (RDE) to show how periodic current control can improve the selectivity for p-aminophenol compared to dc control at the same average production rate. The calculations, which assume pulse-current control and incorporate the effect of double layer charging, are compared to both dc and pulsed current experiments. The calculations predict that higher selectivity can be obtained using periodic control compared to dc control at the same product production rate if the desired product is an intermediate (or derived therefrom) in a series of two electrochemical reactions and if the initial electrochemical reaction is more sensitive to potential than the second reaction. Specifically for the reduction of nitrobenzene, the intermediate is phenylhydroxylamine, from which p-aminophenol is derived by chemical reaction, and the second electrochemical reaction is its reduction to aniline. Low duty cycles and high frequencies for the current pulses

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The periodic, electrochemical codeposition of cadmium and tellurium

Cited by 19 publications

References 35 publications

Electrodeposition of Semiconductors

Electrodeposition of Semiconductors

Effect of Corrosion on the Composition of Pulse‐Plated Cu‐Ni Alloys

Reaction Selectivity Enhancement under Periodic‐Current Control: The Reduction of Nitrobenzene on the Rotating Disk Electrode

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