The origins of stress in thin nickel films

Doljack, F. A.; Hoffman, R. W.

doi:10.1016/0040-6090(72)90396-3

Cited by 191 publications

(76 citation statements)

References 3 publications

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“…5 This model captures the experimentally observed effects, but it lacks the simplicity of the description by Doljack and Hoffman. 7 Stress development in films made out of high melting point materials is much more traceable. In those films the grain boundaries are formed at the arrival of the atoms at the growing surface of the film.…”

Section: Introductionmentioning

confidence: 99%

“…The physics underlying this proportionality of tensile stress and number of grain boundaries per unit length is the grain boundary shrinking, as introduced by Doljack and Hoffman in their seminal paper. 7 Compressive stress is caused by ion peening. 11,12 An ion bombardment on the growing film induces defects, either argon or self-interstitials, leading to compressive stress.…”

Section: Introductionmentioning

confidence: 99%

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Stress gradients in CrN coatings

Janssen

Tichelaar

Visser

2006

Journal of Applied Physics

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Stress in hard films is the net sum of tensile stress generated at the grain boundaries, compressive stress due to ion peening, and thermal stress due to the difference in thermal expansion of the coating and substrate. The tensile part due to grain boundaries is thickness dependent. The other two contributions are not thickness dependent. Summation of the three components leads to a stress gradient in the coating. In the present paper it is demonstrated that adding the three contributions mentioned above yields a good description of the observed dependence of stress on thickness in CrN coatings.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Stress gradients in CrN coatings

Janssen

Tichelaar

Visser

2006

Journal of Applied Physics

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“…1 Intrinsic tensile stress in fcc metal films has been interpreted successfully by Doljack and Hoffman in 1972. 2,3 Those relatively soft films exhibit grain growth during deposition. This leads to films with a microstructure consisting of more or less equiaxed grains with grain size about equal to the film thickness (h).…”

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confidence: 99%

Tensile stress in hard metal films

Janssen

Dammers²,

Sivel³

et al. 2003

Applied Physics Letters

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Thin films on substrates are usually in a stressed state. An important, but trivial, contribution to that stress stems from the difference in thermal expansion coefficient of substrate and film. Much more interesting are the intrinsic stresses, resulting from the growth and/or microstructure of the film. Intrinsic compressive stress was explained by d'Heurle in 1970. Intrinsic tensile stress for recrystallizing metal films was treated succesfully by Doljack and Hoffman in 1972. In the present letter we explain the occurrence of tensile stress in nonrecrystallizing metal films. The explanation is based on modern grain growth models and accurate stress measurements. The key ingredient to the explanation is the proof of the existence of a stress gradient in nonrecrystallizing metal films.

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“…Instead he assumed that as atoms are deposited on an island surface near the point of impingement, they are more likely to arrive in the attractive region of the asymmetric potential well describing atomic interactions thereby resulting in a net tensile attraction between coalesced islands. 6,7 Hoffman interpreted this process as a "constrained relaxation" due to local atomic rearrangement within the grain boundary and not as a uniform stretching of the islands. The resulting "distortion" ∆ of the boundary can be estimated to be slightly less than 1 Å (independent of island size and surface energy) so that the associated average biaxial tensile stress in the film is:…”

Section: Introductionmentioning

confidence: 99%

“…[3][4][5] Hoffman postulated that during the island impingement stage of growth, neighboring islands will stretch towards each other and coalesce in order to reduce surface energy at the expense of an associated strain energy. 6,7 Although Hoffman suggested that tensile stress generation is driven by a reduction in surface energy during island coalescence, he did not use this idea to estimate the associated stress. Instead he assumed that as atoms are deposited on an island surface near the point of impingement, they are more likely to arrive in the attractive region of the asymmetric potential well describing atomic interactions thereby resulting in a net tensile attraction between coalesced islands.…”

Section: Introductionmentioning

confidence: 99%

Modeling metallic island coalescence stress via adhesive contact between surfaces

et al. 2006

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PACS number(s): 68.35.Np, 61.50.Lt, 71.15.Pd Tensile stress generation associated with island coalescence is almost universally observed in thin films that grow via the Volmer-Weber mode. The commonly accepted mechanism for the origin of this tensile stress is a process driven by the reduction in surface energy at the expense of the strain energy associated with the deformation of coalescing islands during grain boundary formation. In the present work, we have performed molecular statics calculations using an embedded atom interatomic potential to obtain a functional form of the interfacial energy vs distance between two closely spaced free surfaces. The sum of interfacial energy plus strain energy provides a measure of the total system energy as a function of island separation. Depending on the initial separation between islands, we find that in cases where coalescence is thermodynamically favored, gap closure can occur either spontaneously or be kinetically limited due to an energetic barrier. Atomistic simulations of island coalescence using conjugate gradient energy minimization calculations agree well with the predicted stress as a function of island size from our model of spontaneous coalescence. Molecular dynamics simulations of island coalescence demonstrate that only modest barriers to coalescence can be overcome at room temperature. A comparison with thermally activated coalescence results at room temperature reveals that existing coalescence models significantly overestimate the magnitude of the stress resulting from island coalescence.2

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The origins of stress in thin nickel films

Cited by 191 publications

References 3 publications

Stress gradients in CrN coatings

Stress gradients in CrN coatings

Tensile stress in hard metal films

Modeling metallic island coalescence stress via adhesive contact between surfaces

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