2018
DOI: 10.1186/s11671-018-2483-8
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The Optimization of Spacer Engineering for Capacitor-Less DRAM Based on the Dual-Gate Tunneling Transistor

Abstract: The DRAM based on the dual-gate tunneling FET (DGTFET) has the advantages of capacitor-less structure and high retention time. In this paper, the optimization of spacer engineering for DGTFET DRAM is systematically investigated by Silvaco-Atlas tool to further improve its performance, including the reduction of reading “0” current and extension of retention time. The simulation results show that spacers at the source and drain sides should apply the low-k and high-k dielectrics, respectively, which can enhance… Show more

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Cited by 4 publications
(6 citation statements)
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“…The spacer technology influences the performance of 1T DRAM. 26) Therefore, we have considered a Si 3 N 4 and HfO 2 spacer with a higher dielectric to study the variation in performance of our proposed 1T DRAM. Figure 8(a) shows the electric-field under the gate after read "1" operation.…”
Section: Impact Of Spacer Dielectricmentioning
confidence: 99%
“…The spacer technology influences the performance of 1T DRAM. 26) Therefore, we have considered a Si 3 N 4 and HfO 2 spacer with a higher dielectric to study the variation in performance of our proposed 1T DRAM. Figure 8(a) shows the electric-field under the gate after read "1" operation.…”
Section: Impact Of Spacer Dielectricmentioning
confidence: 99%
“…This unique design eliminates the redundant capacitor and could further scale down the size of DRAM arrays. 11–13 Nevertheless, it was predominantly performed based on bulk semiconductor materials including doped silicon 14,15 and III–V compounds. 16,17 Besides, the floating body effect will vanish if the body thickness is below 10 nm (a critical thickness for thin film materials) due to the super-coupling effect, eventually leading to the degraded properties of the 1T0C DRAM cell.…”
Section: Introductionmentioning
confidence: 99%
“…But with the continuous progress of voltage scaling down, the unacceptable high-power consumption becomes a serious problem for modern ICs [1,2]. Benefit from the band-to-band tunneling mechanism, tunnel FET (TFET) with steep SS and low-power consumption bring a new solution to this problem and attracted lots of attention [3][4][5][6][7][8][9]. But the applications of conventional silicon-based TFETs are limited by the considerably low on-state current (I ON ), low switching ratio, severe ambipolar effect and large average subthreshold swing (SS) [1,7].…”
Section: Introductionmentioning
confidence: 99%
“…To improve the performance of TFETs, applications of new structures and new materials on TFETs have been proposed in recent years. For example, TFETs with tunneling rate enhanced layer are proposed in recent years [5,10,11]. With this layer, the effective length of tunneling path is reduced and results to an obvious tunneling rate enhancement.…”
Section: Introductionmentioning
confidence: 99%