The New Copper Composite of Pastes for Si Solar Cells Front Electrode Application

Pánek, P.; Socha, Robert P.; Putynkowski, Grzegorz; Slaoui, A.

doi:10.1016/j.egypro.2016.07.108

Cited by 12 publications

(4 citation statements)

References 18 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…So far, no one has ever shown a similar investigation. The preliminary results of our research where copper component, that is Cu powder in a protective coating, referred as XX have been presented by Panek et al 17 For the optimal component, the shell constituted 3% by weight of CuXX grain. The copper filler was mixed with an amount of 50% with commercial silver paste Du Pont PV17D, and it was tested on 5 × 5 cm silicon solar cells produced at the IMMS PAS Photovoltaic Laboratory.…”

Section: Introductionmentioning

confidence: 61%

Silicon solar cells and modules with front contact paste containing copper‐based component

Gawlińska-Nęcek

Socha

Balawender

et al. 2021

Progress in Photovoltaics

Self Cite

View full text Add to dashboard Cite

In this article, we present the results of aging tests of silicon photovoltaic modules with a copper‐containing electrode deposited in one‐step screen printing method. For front metallization, a mixture of commercial silver paste with copper filler was used, where copper constituted 30% of total paste volume. The filler is based on copper particles about 1 μm of diameter covered with a protective coating layer based on nickel (CCu1) or nickel–silver (CCu2). For the first time, Si solar cells with screen‐printed front electrode containing massive copper with efficiency over 20% are reported. Aging tests included 2000 h of damp heat (DH) and 400 times of thermal cycling (TC) tests. TC results are very promising and provide slight deterioration of the electrical parameters of the modules with both CCu1 and CCu2. Greater decreases were found when performed DH tests, but it is worth pointing out that mainly fill factor (FF) and η have fallen while Voc and Isc did not change by more than 5% for both pastes. After 2000 h of the test, FF decreased by 28% for CCu1 and 37.4% for CCu2, whereas the efficiency deteriorated by 32% and 42.6% for CCu1 and CCu2. The electroluminescence (EL) and X‐ray photoelectron spectroscopy (XPS) measurements suggest that decrease in electrical parameters is a consequence of Cu corrosion caused by harmful products of the decomposed EVA laminating film.

show abstract

Section: Introductionmentioning

confidence: 61%

Silicon solar cells and modules with front contact paste containing copper‐based component

Gawlińska-Nęcek

Socha

Balawender

et al. 2021

Progress in Photovoltaics

Self Cite

View full text Add to dashboard Cite

show abstract

“…In the first works on the development of the paste [20], results were presented in which the cells had an fill factor (FF) of 73%. Subsequent work concerned the study of the parameters of CuXX component molecules and the effect of NPCuXX paste on cell parameters [25,26].…”

Section: Fabrication Process Of the Cuxx Component And Pastementioning

confidence: 99%

Copper-Based Volumetric Filler Dedicated for Ag Paste for Depositing the Front Electrodes by Printing on Solar Si Cells

Musztyfaga-Staszuk

Putynkowski²,

Socha

et al. 2018

Materials

Self Cite

View full text Add to dashboard Cite

In this work we present research results on a new paste NPCuXX (where: NP—new paste, CuXX—component, XX—a modifier consisting of Ni and other important elements) based on a copper composite (CuXX) for fabrication of front electrodes in silicon solar cells. The CuXX composite is obtained by chemical processing of copper powder particles and can be used in two ways: as an additive to commercially available paste or as a base material for a new paste, NPCuXX. The CuXX offers the possibility to exchange up to 30 and 50 wt.% Ag into Cu, which significantly decreases the solar cells material costs, and therefore, the overall solar cell price. Emphasis was placed on a proper mass suitable fabrication process of the CuXX component. The NPCuXX paste has been applied both to conventional cell structures such as aluminum-back surface field (Al-BSF) and passivated emitter and rear contact (PERC), and finally solar cells with front electrodes deposited by screen-printing method were fabricated and characterized by current-voltage techniques. This paper reports the first implementation of the copper volumetric material into a screen print paste used in a high-temperature metallization process to fabricate the front contacts of Si solar cells with a highest fill factor of 77.92 and 77.69% for the abovementioned structures, respectively.

show abstract

“…[ 4 ] Therefore, the application of low‐cost front contact processes and materials has attracted many research interests. [ 4,5 ] Among different low‐cost materials, copper (Cu) nanoparticle (NP) inks are possible candidates as low‐cost electrodes for III–V semiconductor‐based solar cells. [ 6 ] Recently, they have been applied considerably as electrode materials for various electronics (e.g., solar cells) due to their low production cost compared with silver or other noble metals.…”

Section: Introductionmentioning

confidence: 99%

1,8‐Octanedithiol as an Effective Intermediate Layer for Deposition of Cu Electrodes via Inkjet Printing and Laser Sintering on III–V Triple‐Junction Solar Cells

Hayati-Roodbari

Wheeldon

Fian

et al. 2022

Physica Status Solidi (a)

View full text Add to dashboard Cite

This research study combines surface modification techniques with back‐end‐of‐line (BEOL) methods for cost‐effective, scalable front contact electrode deposition on III–V solar cells. Copper nanoparticle grids are deposited by inkjet printing on surface‐modified III–V solar cells. The deposition of a self‐assembled monolayer (such as 1,8‐octanedithiol) as an intermediate layer is a proven method for surface modification to improve the wettability of the substrate surface and the adhesion of the printed copper nanoparticle structures on the substrate to perform inkjet printing of coherent and narrow electrode structures. Then, the printed copper ink is converted to a conductive copper grid by a picosecond pulsed laser with optimized settings and an additional galvanic plating step is required for the thickening of inkjet‐printed and laser‐sintered seeding layer for solar cell applications. As a result, an ohmic copper contact on III–V layer with low contact resistivity (5 mΩ cm2) is realized successfully. The processed solar cell shows a functioning behavior with 20% conversion efficiency.

show abstract

The New Copper Composite of Pastes for Si Solar Cells Front Electrode Application

Cited by 12 publications

References 18 publications

Silicon solar cells and modules with front contact paste containing copper‐based component

Silicon solar cells and modules with front contact paste containing copper‐based component

Copper-Based Volumetric Filler Dedicated for Ag Paste for Depositing the Front Electrodes by Printing on Solar Si Cells

1,8‐Octanedithiol as an Effective Intermediate Layer for Deposition of Cu Electrodes via Inkjet Printing and Laser Sintering on III–V Triple‐Junction Solar Cells

Contact Info

Product

Resources

About