2018
DOI: 10.3390/ma11122493
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Copper-Based Volumetric Filler Dedicated for Ag Paste for Depositing the Front Electrodes by Printing on Solar Si Cells

Abstract: In this work we present research results on a new paste NPCuXX (where: NP—new paste, CuXX—component, XX—a modifier consisting of Ni and other important elements) based on a copper composite (CuXX) for fabrication of front electrodes in silicon solar cells. The CuXX composite is obtained by chemical processing of copper powder particles and can be used in two ways: as an additive to commercially available paste or as a base material for a new paste, NPCuXX. The CuXX offers the possibility to exchange up to 30 a… Show more

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Cited by 3 publications
(2 citation statements)
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“…It was found that the obtained solar cells showed parameters comparable with the ones with pure Ag commercial metallization. Moreover, the results also indicate that the XX protective coating properly blocks the diffusion of Cu atoms to the p – n junction 19 …”
Section: Introductionmentioning
confidence: 82%
“…It was found that the obtained solar cells showed parameters comparable with the ones with pure Ag commercial metallization. Moreover, the results also indicate that the XX protective coating properly blocks the diffusion of Cu atoms to the p – n junction 19 …”
Section: Introductionmentioning
confidence: 82%
“…The model’s big advantage is taking into account the influence of the boric acid concentration in dopant sources on final concentration profiles of the obtained layer. This enables determination of concentration profiles for intermediate parameters of the diffusion doping process, and the obtained results may be used instead of time-consuming and costly SIMS measurements, which facilitates focusing on optimizing other technological processes of solar cell fabrication, such as production of electrodes (Musztyfaga-Staszuk et al , 2018; Drabczyk and Panek, 2014; Musztyfaga-Staszuk and Dobrzanski, 2014), an anti-reflective layer (Swatowska, 2018; Swatowska et al , 2011) or a surface texture on the top of wafer (Kulesza-Matlak et al , 2018; Kulesza et al , 2014).…”
Section: Discussionmentioning
confidence: 99%