2019
DOI: 10.1002/aelm.201900029
|View full text |Cite
|
Sign up to set email alerts
|

The Motivation for and Challenges to Scaling Down Organic Field‐Effect Transistors

Abstract: v) operating frequency, [13][14][15] vi) contact resistance, [16][17][18][19] vii) crystallinity and grain boundaries of the organic thin films, [20][21][22] viii) active matrix OFET array or integrated circuit, [23][24][25][26][27][28] ix) novel deposition techniques, [29][30][31][32][33] x) unconventional substrates for OFETs, [34][35][36][37] xi) physical or biological sensors, [38][39][40][41][42][43][44] etc. The progress in all these different aspects has framed the development roadmap of the OFETs. Amon… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1

Citation Types

0
19
0
1

Year Published

2019
2019
2022
2022

Publication Types

Select...
9

Relationship

1
8

Authors

Journals

citations
Cited by 25 publications
(20 citation statements)
references
References 135 publications
(154 reference statements)
0
19
0
1
Order By: Relevance
“…Such a value of R c is not only a key requirement in order to access frequency regimes in excess of 100 MHz, [15,19] but is among the best reported values for OFETs in general and is extremely low when considering the case of transistors realized via direct-writing, solution-based methods and optimized for low geometrical overlap of electrodes and high frequency operation. [37][38][39] We then measured the AC characteristics of our device by means of S-parameters, using a setup already described in our previous work, [27] calibrated with a SOLT procedure and corrected with a 12-term error model. From the measured S-parameters, the parasitic contributions of the pads and interconnections are de-embedded from the measurement with a one-step procedure [40] and the hybrid parameter h 21 is extracted (Figure 2c), allowing to identify f t according to h 21 (f t ) = 0 dB, which yields an unprecedented f t of 160 MHz at a bias voltage of 40 V for OFETs in the case of the best device (Figure 2c, linear fit).…”
Section: Resultsmentioning
confidence: 99%
“…Such a value of R c is not only a key requirement in order to access frequency regimes in excess of 100 MHz, [15,19] but is among the best reported values for OFETs in general and is extremely low when considering the case of transistors realized via direct-writing, solution-based methods and optimized for low geometrical overlap of electrodes and high frequency operation. [37][38][39] We then measured the AC characteristics of our device by means of S-parameters, using a setup already described in our previous work, [27] calibrated with a SOLT procedure and corrected with a 12-term error model. From the measured S-parameters, the parasitic contributions of the pads and interconnections are de-embedded from the measurement with a one-step procedure [40] and the hybrid parameter h 21 is extracted (Figure 2c), allowing to identify f t according to h 21 (f t ) = 0 dB, which yields an unprecedented f t of 160 MHz at a bias voltage of 40 V for OFETs in the case of the best device (Figure 2c, linear fit).…”
Section: Resultsmentioning
confidence: 99%
“…[17] However, the contact resistance (R C ) persists as a major impediment toward further development of circuits based on organic transistors. [18][19][20][21] This is especially true for the development of organic TFTs for low-power, high-frequency applications, such as mobile activematrix displays, since a high R C limits the maximum unitycurrent-gain-cutoff (transit) frequency that would otherwise be expected through device miniaturization. [22] High contact resistance in organic TFTs continues to be a major problem despite significant strides in expanding both the breadth of To take full advantage of recent and anticipated improvements in the performance of organic semiconductors employed in organic transistors, the high contact resistance arising at the interfaces between the organic semiconductor and the source and drain contacts must be reduced significantly.…”
Section: Introductionmentioning
confidence: 99%
“…12,13 Moreover, to reach a higher level of integration, OFETs are always in an array form with high spatial resolution. 14 These applications require the precise patterning of OSC thin films. 15,16 Well-patterned OSCs can avoid unwanted leakage current, lower the off-state current and reduce crosstalk between neighboring devices.…”
Section: Introductionmentioning
confidence: 99%