1997
DOI: 10.1088/0022-3727/30/23/002
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The modelling of radio frequency hydrogen plasmas in the reactive ion etching of GaAs

Abstract: Radio frequency hydrogen plasma etching of GaAs wafers can lead to large-scale stoichiometric changes in the GaAs substrate which vary with the process pressure and power and can affect device performance. These changes are thought to be due to the penetration depth of hydrogen species and the probability of an ion or neutral species either stopping in the surface oxide layer or penetrating the bulk substrate. A computer model has been devised which follows ion trajectories across the sheath and predicts ion a… Show more

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Cited by 3 publications
(4 citation statements)
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“…The potentials at the surface of the quartz were therefore measured using a metallic plate at the same potential as the quartz surface, connected by a ceramic-covered wire to a high-voltage probe and oscilloscope. The resulting DC component of the measured potentials are 0.3-0.4 times the DC bias [31].…”
Section: Diagnostic Tool Measurementsmentioning
confidence: 94%
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“…The potentials at the surface of the quartz were therefore measured using a metallic plate at the same potential as the quartz surface, connected by a ceramic-covered wire to a high-voltage probe and oscilloscope. The resulting DC component of the measured potentials are 0.3-0.4 times the DC bias [31].…”
Section: Diagnostic Tool Measurementsmentioning
confidence: 94%
“…Between the sheaths, the bulk of the plasma is field free. Recent modelling of argon and hydrogen ion energies in the current plasma cell have indicated that these approximations are acceptable and give good agreement with ion energies at the anode [31].…”
Section: Modelling Of Electron Energiesmentioning
confidence: 98%
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