The Modal Substructuring Method: An Efficient Technique for Large-Size Numerical Simulations

Laffay, P. O.; Quemener, Olivier; Neveu, A.; Elhajjar, B.

doi:10.1080/10407790.2011.609113

Cited by 8 publications

(2 citation statements)

References 23 publications

(52 reference statements)

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“…Inspired by the classical decomposition in Fourier series, the temperature is searched as a sum of known elementary spatial functions, called the modes, weighted by unknown coefficients. However, the creation of the modal model is more complex and the current study focuses on the substructuring modal method [20]. This latter allows the chip to be handled separately and to reduce it more efficiently.…”

Section: Reduced-order Modal Modelmentioning

confidence: 99%

Thermo-Fluidic Characterizations of Multi-Port Compact Thermal Model of Ball-Grid-Array Electronic Package

et al. 2020

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The concept of a single-input/multi-output thermal network was proposed by the Development of Libraries of Physical models for an Integrated design environment (DELPHI) consortium more than twenty years ago. The present work highlights the recent improvements made to efficiently derive a low-computing-effort model from a fully detailed numerical model and to characterize its performances. The temperature predictions of a deduced ball-grid-array (BGA) dynamic compact thermal model are compared to those of a realistic three-dimensional representation, including the large set of internal copper traces, as well as its board structure, which has been validated by experiment. The current study discloses a method for creating an amalgam reduced-order modal model (AROMM) for that electronic component family that allows the preservation of the geometry integrity and shortening scenarios computation. Typically, the AROMM method reduces by a factor of 600 the computation time needed to obtain the solution while keeping the error on the maximum temperature below 2%. Then, a meta-heuristic optimization is run to derive a more practical low-order resistor capacitor model that enables a thermo-fluidic analysis at the board level. Based on the calibrated numerical model, a novel AROMM method was investigated in order to address the chip behavior submitted to multiple heat sources. The first results highlight the capability to enforce a non-uniform power distribution on the upper surface of the silicon chip. Thus, the chip design layout can be analyzed and optimized to prevent thermal and reliability issues.

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Section: Reduced-order Modal Modelmentioning

confidence: 99%

Thermo-Fluidic Characterizations of Multi-Port Compact Thermal Model of Ball-Grid-Array Electronic Package

et al. 2020

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“…These studies have employed the substructure technique to avoid calculating a complete basis when the domain leads to large matrices or increase precision on regions of interest. Finally, two studies 30,31 used the BERM method with a branch basis when solving heat transfer problem in a substructured configuration. In continuation of these previous works, the aim of the present study is to develop the AROMM method for a shell geometry using the branch basis associated with a substructuring technique, to simulate the thermal behavior of a simplified part of an LNG tanker.…”

Section: Introductionmentioning

confidence: 99%

Simulation of a set of large‐size thermal enclosures by a substructured reduced‐order model

2020

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In the context of simulations of coupled thermal enclosures, we present here a substructuring technique adapted to the amalgam reduced‐order modal model (AROMM). This technique consists of splitting the geometry into different zones. A modal model is then applied to each zone, and the coupling of the resulting models is performed via a thermal contact resistance. This technique allows the consideration of physical thermal resistances between different components of the geometry, as well as the making of fictitious cuts within a continuous domain, when its large size causes difficulties in obtaining the global reduced model. Applied to the simulation of a simplified component of a liquefied natural gas carrier, the use of a substructured model with 200 modes allows an access to the whole temperature field with a maximum difference near 1 K and an average difference of the order of 0.2 K, compared with a conventional Lagrange finite‐element model of shell type, which requires 60 times longer calculation.

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Finite element model reduction for space thermal analysis

Jacques

Béchet

Kerschen

2017

Finite Elements in Analysis and Design

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The Modal Substructuring Method: An Efficient Technique for Large-Size Numerical Simulations

Cited by 8 publications

References 23 publications

Thermo-Fluidic Characterizations of Multi-Port Compact Thermal Model of Ball-Grid-Array Electronic Package

Thermo-Fluidic Characterizations of Multi-Port Compact Thermal Model of Ball-Grid-Array Electronic Package

Simulation of a set of large‐size thermal enclosures by a substructured reduced‐order model

Finite element model reduction for space thermal analysis

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