The microstructure of η′-Cu6Sn5 and its orientation relationships with Cu in the early stage of growth

Morphologies and grain orientations of Cu–Sn intermetallic compounds in Sn3.0Ag0.5Cu/Cu solder joints

“…They found that strong texture of Cu 6 Sn 5 grains was formed in the normal direction although the Sn/(011) Cu couple was aged at 170 1C for 40days. The relationship between Cu and Z 0 -Cu 6 Sn 5 in the early stage of growth was reported by Wang et al [11]. They have also identified the orientation relationships between Z-Cu 6 Sn 5 and Cu by TEM.…”

Effect of Ni on phase stability and thermal expansion of Cu6−xNixSn5 (X = 0, 0.5, 1, 1.5 and 2)

“…One physical property of Cu 6 Sn 5 which is greatly affected by the h to h 0 and h 0 to h transformations is the sample volume and thermal expansion behaviour. The Coefficient of Thermal Expansion (CTE) of Cu 6 Sn 5 between 60 and 160 C [19] and between 100 and 250 C [20] has been investigated. A computational prediction of a non-linear thermal expansion and a CTE value higher than the experimental result has also been suggested for monoclinic Cu 6 Sn 5 [21].…”

Phase-field study of IMC growth in Sn–Cu/Cu solder joints including elastoplastic effects

“…A full description of the eigenstrain in each phase, requires knowledge of the crystallographic structure of each phase and the orientation relationship between the different phases [41]. There are a few measurements of orientation relationships and lattice spacings for Cu 3 Sn and Cu 6 Sn 5 available in the literature [42,43,44,45,46,47,11]. Shang et al [47,46] have measured the lattice spacings of Cu and Cu 3 Sn for several orientation pairs in SnBi/Cu solder joints.…”