1982
DOI: 10.1063/1.331639
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The mechanism of (Hg,Cd)Te anodic oxidation

Abstract: It has been determined that anodic oxidation of (Hg,Cd)Te occurs via a dissolution-precipitation mechanism followed by a bulk growth process which involves either interstitial transport of metal cations and/or hydroxyl anion transport via successive jumps. The initial film formation can be understood at least partially in terms of electrochemical parameters and, therefore, can be controlled in a rational manner. For example, stirring the anodization solution during dissolution prohibits film formation due to a… Show more

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Cited by 31 publications
(23 citation statements)
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“…The initial stages of the oxide film growth have long been considered to occur by a dissolution-precipitation mechanism [9]. On scanning the potential positive, dissolution of the semiconductor surface continues at an increasing rate until the concentration of the dissolved species approaches its solubility limit.…”
Section: Anodic Oxide Growthmentioning
confidence: 99%
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“…The initial stages of the oxide film growth have long been considered to occur by a dissolution-precipitation mechanism [9]. On scanning the potential positive, dissolution of the semiconductor surface continues at an increasing rate until the concentration of the dissolved species approaches its solubility limit.…”
Section: Anodic Oxide Growthmentioning
confidence: 99%
“…During the electrochemical formation of the anodic oxide layer, the MCT substrate material is consumed and sharp interfaces have thus been reported to form [2]. Oxide growth is usually carried out using the well established constant current anodisation method [5,9,10] in 0.1 M KOH in 90% ethylene glycol/10% H 2 O.…”
Section: Introductionmentioning
confidence: 99%
“…case of detectors passivated by CdTe in comparison to those passivated by AO. Improvement in the detector performance by CdTe passivation is on the expected lines as the AO/n-HgCdTe interface had been reported to contain large fixed positive charges, [24][25][26][27][28][29][30] leading to over accumulation of n-HgCdTe surface causing degradation in the detector performance. 31,32 The AO is grown by an electrochemical process and the oxidation reaction is reported to be strong enough to damage the HgCdTe (x ϭ 0.2) surface up to a depth of ϳ200 Å beneath the oxide-HgCdTe interface.…”
Section: Detector Performancementioning
confidence: 99%
“…Recently, we presented a generalized PC model including this effect [5] for HgCdTe PC devices. Real detectors are always having both front and rear surfaces passivated with native anodic oxide which accumulates the n-type mercury cadmium telluride (n-HgCdTe or MCT) surface due to its positive fixed surface state charge density (Q ss ) at the MCT surface [6]. The accumulation layers at the front and rear surface are sources of shunt resistances in these detectors.…”
Section: Introductionmentioning
confidence: 99%