The mechanism of crystallographic ordering in CuPt

Elastic properties and plastic deformation of TiC- and VC-based pseudobinary alloys

“…The C#3 structure consists of alternating (111) metal sublattice planes containing M 1 :M 2 fractions of 3:1 and 1:3, respectively. It is closely related to the CuPt-ordered structure in binary metals [38], as well as TiWN [39] and VWN [23] solid solutions, which consist of alternating {111} cation planes that are either primarily M 1 or primarily M 2 . However, while the CuPt structure is rhombohedral, the C#3 structure is cubic.…”

Influence of the degree of order of InGaP on its hardness determined using nanoindentation

“…4,11,12 In their study on the mechanical properties of ordered alloys, Stoloff and Davies observed that a peak in hardening takes place when the ordered domains size is around 6 nm. This is contrary to the orderhardening behavior observed in CuPt metal alloys.…”

“…Its relatively high band gap ͓E g ͑In 0.49 Ga 0.51 P,T=300 K͒ = 1.90 eV͔ ͑Ref. 4 The degree of order of the InGaP semiconductor is influenced by the growth temperature, V/III ratio of the precursor gases as well as surface conditions of the substrate. By changing the ratio of In to Ga, the band gap energy of InGaP can be tuned.…”

“…4,11,12 The objective of this work is to determine whether the order-hardening behavior of the CuPt metal alloy is also applicable to InGaP, an epitaxially grown semiconductor alloy. Metallurgical studies of CuPt alloys demonstrated that ordering is accompanied by a significant increase in hardness.…”

Robert Cahn's work on intermetallics

“…Working with Irani on long-range order in CuPt, he showed that ordering is here a nucleation and growth process. Ordered domains nucleate at sites on boundaries and the free surface but, interestingly, the material inside the grains begins to order homogeneously before domains, nucleated at the boundaries, penetrate far into the grains [3].…”