The maleimide modified epoxy resins for the preparation of UV‐curable hybrid coatings

Abstract

In the present study, maleimide-modified epoxide resin containing UV-curable hybrid coating materials were prepared and coated on polycarbonate substrates in order to improve their surface properties. UV-curable, bismaleimide-modified aliphatic epoxy resin was prepared from N-(p-carboxyphenyl) maleimide (p-CPMI) and cycloaliphatic epoxy (Cyracure-6107) resin. The structure of the bismaleimide modified aliphatic epoxy resin was analyzed by FTIR and the characteristic absorption band for maleimide ring was clearly observed at 3100 cm S1 . Silica sol was prepared from tetraethylorthosilicate (TEOS) and methacryloxy propyl trimethoxysilane (MAPTMS) by sol-gel method. The coating formulations with different compositions were prepared from UV-curable bismaleimide-based epoxy oligomer and sol-gel mixture. The molecular structure of the hybrid coating material was analyzed by 29 Si-CP/ MAS NMR spectroscopy techniques. In the 29 Si CP/MAS NMR spectrum of the hybrid coating, mainly two kinds of signals were observed at S68 and S110 ppm that correspond to T 3 and Q 4 peaks, respectively. This result shows that a fully condensed structure was obtained. The thermal and morphological properties of these coatings materials were investigated by using TGA and SEM techniques. Hardness and abrasion resistance properties of coating materials were examined and both were found to increase with sol-gel precursor content of the coating. The photopolymerization kinetics was investigated by using RT-IR. 70% conversion was attained with the addition of 15 wt% of BMI resin into the acrylate-based coating formulation. It was found that the UV-curable organic-inorganic hybrid coatings improved the surface properties of polycarbonate.

Mechanical properties of sol–gel coatings on polycarbonate: a review

“…These precursors, which have to be thermally or photo-chemically cured leads to an organic network, tangled up to the inorganic one. Close to this approach, it is also reported that the addition of pure organic monomers to the network former performs a double reticulation and creates a convolution of both O/I networks [4,10,[22][23][24][25]. In any case, sol-gel process mastery is primordial to prepare a stable sol, able to be deposited and reticulated in a three dimensions O/I hybrid network.…”

Preparation and stability of silica sol/TPGDA dispersions and its application in the UV-curable hybrid coatings for fire protection

“…Moreover, considering the potential impact of residual solvent on performances of the hybrid coating materials, two sols T1K2E0 and T1K2E6 were used to form samples H-TIK2E0 and H-T1K2E6 in the same operation, respectively. According to relevant literatures [25,38], their UVcuring properties were studied by FTIR spectroscopy, which is based on recording the change in (C=C) double bond absorption of acrylate groups at 1,634/cm. In one set of experiments, the formulations were coated on KBr disks in the usual way.…”

“…7, it can be found that (C=C) double bond conversions of the blank, H-T1K2E6, H-T1K2E6-A, H-TIK2E0 and H-TIK2E0-A are 88, 75, 72, 66 and 65 %, respectively. It should be mentioned that the acrylate group of MPS may have a lower activity, and is restricted by the colloidal matrix [25,38]. Based on the reason, it can be explained that, (1) (C=C) double bond conversions of the hybrid system (H-T1K2E6, H-T1K2E6-A, H-TIK2E0 and H-TIK2E0-A) are lower 13-23 % than that of the blank; (2) in the hybrid system, conversions of H-TIK2E0 and H-TIK2E0-A are lower than those of the other two because …”

Synthesis and characterization of amino-terminated hyperbranched polymer and its effect on impact resistance of epoxy resin thermosets

“…Consequently, epoxy resins are used for a wide range of applications such as adhesives, coatings, mechanic and electronic materials, molding compounds, composites, and in structural application [4][5][6][7][8][9][10][11]. Although epoxy resins are used for a wide range of applications, their brittleness, due to the high crosslink density in epoxy cure systems, is a major drawback for several advanced applications [12][13][14].…”