The magnetic properties of r.f.-sputtered permalloy and Mumetal films

Compositional and Deposition Rate Dependence upon RF Substrate Bias of RF Sputtered Ni-Fe Films

“…A similar reduction in the nickel concentration of bias sputtered has been observed in nickel-iron films by Collins et al [10]. They also proposed that the reductions observed were due to the higher sputtering yield of nickel compared with that of other elements in the alloys.…”

Comparison of magnetic and structural properties of permalloy Ni80Fe20 grown by dc and high power impulse magnetron sputtering

“…It has been employed in many applications, such as anisotropic magnetoresistance (AMR) and planar Hall effect (PHE) field sensors [1], magnetic recording heads [2][3][4][5] and magnetoresistive random access memory (MRAM) [6,7]. Thin permalloy films have been deposited by thermal evaporation [8,9], electroplating [10][11][12], electron beam deposition [13], rf diode sputtering [14][15][16], dc magnetron sputtering (dcMS) [16][17][18] and rf magnetron sputtering [19]. It is well known that the electrical and magnetic properties are influenced by the deposition conditions and method [14,15].…”

“…Thin permalloy films have been deposited by thermal evaporation [8,9], electroplating [10][11][12], electron beam deposition [13], rf diode sputtering [14][15][16], dc magnetron sputtering (dcMS) [16][17][18] and rf magnetron sputtering [19]. It is well known that the electrical and magnetic properties are influenced by the deposition conditions and method [14,15]. We have recently shown that a tilt deposition geometry with respect to the substrate normal using dcMS induces strong in-plane uniaxial anisotropy, i.e.…”

An Investigation into the Effects of Substrate Temperature on Magnetic Properties of RF Sputtered NiFe Films

“…Figure 1 shows the experimental variation of coercivity with substrate temperature for a film thickness close to 1000 o A [16]. Also included are results from Chapman [3] and Collins et al [17]. The experimental result (curve A) shows a coercive force decreasing slowly from 60 o C substrate temperature to a value of 100 A/m at a temperature of approximately 250 o C and exhibiting a broad minimum at 180 o C. Beyond the minimum a rapid rise in coercivity is evident doubling over a further 100 o C temperature rise.…”

“…The accompany results of Collins et al [17] and Chapman [3] are included in figure 2 whilst there results should not be compared in detail because they related to films of differing thickness.…”