The infrastructure of the timed EOPNs-based multiple-objective real-time scheduling system for 300 mm wafer fab

Liu, H.; Jiang, Zhibin; Fung, Richard Y. K.

doi:10.1080/00207540600595793

Cited by 8 publications

(3 citation statements)

References 13 publications

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“…The complicated characteristics in semiconductor manufacturing processes include: hundreds of complex operations, re-entrant flows, uncertain yield, unreliable machines, sensitive to environment and multi-objective optimization. All these intricate characteristics along with the drastic competition on larger throughput and shorter cycle time make technology innovation on system performance evaluation, semiconductor planning and scheduling encounter great opportunity and challenge (Liu and Jiang 2007).…”

Section: Zhibin Jiang Shanghai Jiao Tong Universitymentioning

confidence: 99%

Modeling and analysis of semiconductor manufacturing in a shrinking world: Challenges and successes

Chien

Dauzère‐Pérès

Ehm

et al. 2008

2008 Winter Simulation Conference

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A panel session on the role of modeling and analysis in semiconductor manufacturing in a shrinking world is presented. Therefore, two participants are from Asia, two from Europe, and two from US and there are two panel organizers/moderators (Fowler and Mönch). One panelist from each continent is from industry and one from academia. Only initial position statements are included in the proceedings. However, these initial statements form the basis for the panel discussion. The statements of the panelists from industry relate to modeling and analysis problems found in their own companies. The position statements of the panelists from academia describe the role that modeling and analysis is expected to play in their current and ongoing research in semiconductor manufacturing. Furthermore, their views on the challenges and successes of modeling and analysis in a globalized world are also included.

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Section: Zhibin Jiang Shanghai Jiao Tong Universitymentioning

confidence: 99%

Modeling and analysis of semiconductor manufacturing in a shrinking world: Challenges and successes

Chien

Dauzère‐Pérès

Ehm

et al. 2008

2008 Winter Simulation Conference

View full text Add to dashboard Cite

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“…Their key initiative was to develop the scheduling application that could react quickly to the ever-changing manufacturing floor. Liu et al (2007) developed an infrastructure of the timed EOPNs-based multiple-objective real-time scheduling system to tackle complex 300 mm wafer fabs. Four specific performance objectives pursued by contemporary semiconductor manufacturers were integrated into a priority-ranking algorithm, and then all wafer lots would be dynamically dispatched by the real-time state-dependent dispatching system.…”

Section: Literature Reviewmentioning

confidence: 99%

Development of an integrated real time dispatching system

Yao

et al. 2014

Journal of Manufacturing Technology Management

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Access to this document was granted through an Emerald subscription provided by emerald-srm:464745 [] For AuthorsIf you would like to write for this, or any other Emerald publication, then please use our Emerald for Authors service information about how to choose which publication to write for and submission guidelines are available for all. Please visit www.emeraldinsight.com/authors for more information. About Emerald www.emeraldinsight.comEmerald is a global publisher linking research and practice to the benefit of society. The company manages a portfolio of more than 290 journals and over 2,350 books and book series volumes, as well as providing an extensive range of online products and additional customer resources and services.Emerald is both COUNTER 4 and TRANSFER compliant. The organization is a partner of the Committee on Publication Ethics (COPE) and also works with Portico and the LOCKSS initiative for digital archive preservation. AbstractPurpose -In a complex semiconductor manufacturing system (SMS) environment, the implementation of dynamic production scheduling and dispatching strategies is critical for SMS distributed collaborative manufacturing events to make quick and correct decisions. The purpose of this paper is to assist manufacturers in achieving the real time dispatching and obtaining integrated optimization for shop floor production scheduling. Design/methodology/approach -In this paper, an integrated model is designed under assemble to order environment and a framework of a real time dispatching (IRTD) system for production scheduling control is presented accordingly. Both of the scheduling and ordering performances are integrated into the days of inventory based dispatching algorithm, which can deal with the multiple indicators of dynamic scheduling and ordering in this system to generate the "optimal" dispatching policies. Subsequently, the platform of IRTD system is realized with four modules function embedded. Findings -The proposed IRTD system is designed to compare the previous constant work in process method in the experiment, which shows the better performance achievement of the IRTD system for shop floor production dynamic scheduling and order control. The presented framework and algorithm can facilitate real time dispatching information integration to obtain performance metrics in terms of reliability, availability, and maintainability. Research limitations/implications -The presented system can be further developed to generic factory manufacturing with the presented logic and architecture proliferation. Originality/value -The IRTD system can integrate the real time customer demand and work in process information, based on which manufacturers can make correct and timely decisions in solving dispatching strategies and ordering selection within an integrated information system.

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“…Thus, the timed EOPNs approach can make the modeling of the wafer fab more concise, authentic, and manageable. Liu et al (2007) developed a timed EOPN-based multiple-objective real-time scheduling system that leaded to a better real-time performance and adaptability. Hsieh et al (2007) designed a fast simulation-based scheduling policy by an innovative integration of ordinal optimization and design of experiments to efficiently select a good scheduling policy for fab operations.…”

Section: An Integrated Dispatching Rulementioning

confidence: 99%

An integrated dispatching rule with on‐line rework consideration in wafer fabrication

Hsu

Sha²,

Chang³

2009

Jnl of Manu Tech Mnagmnt

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Purpose -In wafer fabrication, the material cost of wafer is expensive. It is imperative to repair the defective wafers produced during the manufacturing process for reducing the cost and increasing the yield of wafer fabrication. However, repairing defective wafer will not only increase the work-in-process (WIP) level but the flow time of rework lots as well. In wafer fabrication, rework of wafer is only allowed in the photolithography area, where is the bottleneck of the entire wafer fab. The purpose of this paper is to develop a dispatching rule concerned with rework for photolithography area. Design/methodology/approach -The research developed a load-oriented integrated rule, Re-Disp, to consider the lots' sequencing decision and rework consideration at the photolithography area, in wafer fabrication. Simulation test and statistical analysis have been done on a virtual wafer fabrication plant. In the simulation model, some combinations of dispatching and rework rules, which are popular in practice, have been modeled for benchmarking. Findings -Integrated rules, Re-Disp, is better than those combinations of dispatching rules and rework rules under statistical analysis. System will be more stable when the integrated dispatching rule is used for control of the wafer schedule. Originality/value -The paper developed a new dispatching rule for wafer fabrication concerned with rework for photolithography.

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The infrastructure of the timed EOPNs-based multiple-objective real-time scheduling system for 300 mm wafer fab

Cited by 8 publications

References 13 publications

Modeling and analysis of semiconductor manufacturing in a shrinking world: Challenges and successes

Modeling and analysis of semiconductor manufacturing in a shrinking world: Challenges and successes

Development of an integrated real time dispatching system

An integrated dispatching rule with on‐line rework consideration in wafer fabrication

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