2016
DOI: 10.1587/elex.13.20160852
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The influence of the <i>N</i><sup>+</sup> floating layer on the drift doping of RESURF LDMOS and its analytical model

Abstract: The influence of the N + floating layer on the drift doping of RESURF LDMOS is studied in this paper. By optimizing the electric field distribution, a new RESURF criterion for LDMOS with N + floating layer is developed as: N D t S ≤ 0.83 × 10 12 cm −2 (N D and t S are the drift doping and thickness, respectively). The optimal drift doping is smaller than that of Single RESURF LDMOS (N D t S ≤ 1.4 × 10 12 cm −2 ). Both analytical and numerical results show the N + floating layer can be used to increase the brea… Show more

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“…Scholars have obtained many results after long-term research on StBV. Some of these results have been obtained using an analytical model of StBV [8][9][10][11][12][13][14], and others are related to new structures [15][16][17][18][19][20][21][22][23][24][25][26][27], in some of which StBV can reach more than 1000 V [25][26][27]. However, when a device is turned off rapidly, there is insufficient time for an electron inversion layer to form under the BOX, which can induce a DD effect in the Micromachines 2023, 14, 887 2 of 14 substrate.…”
Section: Introductionmentioning
confidence: 99%
“…Scholars have obtained many results after long-term research on StBV. Some of these results have been obtained using an analytical model of StBV [8][9][10][11][12][13][14], and others are related to new structures [15][16][17][18][19][20][21][22][23][24][25][26][27], in some of which StBV can reach more than 1000 V [25][26][27]. However, when a device is turned off rapidly, there is insufficient time for an electron inversion layer to form under the BOX, which can induce a DD effect in the Micromachines 2023, 14, 887 2 of 14 substrate.…”
Section: Introductionmentioning
confidence: 99%
“…LDMOS transistors can be improved by increasing the length of the drift region and adjusting doping profiles to realize the reduced surface field (RESURF) condition [11], [12], [13]. On the other hand, to improve the on-state resistance, the total length of the power device needs to be reduced.…”
Section: Introductionmentioning
confidence: 99%